Dual micro-electro mechanical system and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-12595167-B2
Application number	US-202418640142-A
Country	US
Kind code	B2
Filing date	Apr 19, 2024
Priority date	Oct 30, 2019
Publication date	Apr 7, 2026
Grant date	Apr 7, 2026

Abstract

A micro electro mechanical system (MEMS) includes a circuit substrate, a first MEMS structure disposed over the circuit substrate, and a second MEMS structure disposed over the first MEMS structure.

First claim

What is claimed is:

1 . A device, comprising:
a substrate; a first structure disposed over the substrate; a second structure disposed over the first structure; and a cover disposed over the second structure, wherein the first structure includes a first capacitance sensor configured to detect movement along a first direction and a second capacitance sensor configured to detect movement along a second direction perpendicular to the first direction, the first structure includes one or more first anchors and a first proof mass, wherein the first proof mass is supported by one or more springs each connected to one of the one or more first anchors, the second structure includes a second anchor and a second proof mass, wherein the second anchor is connected to one of the one or more first anchors by a first via electrode, and the second proof mass is connected to the first proof mass by a second via electrode.

2 . The device of claim 1 , wherein an area of the first via electrode is greater than an area of the second via electrode.

3 . The device of claim 1 , wherein an area of the second via electrode is 30% to 80% of the area of the first via electrode.

4 . The device of claim 1 , wherein a bottom of the second via electrode is located at a middle of the first proof mass.

5 . The device of claim 1 , wherein the first via electrode is electrically connected to the substrate.

6 . A device, comprising:
a substrate; a first structure disposed over the substrate; a second structure disposed over the first structure; and a cover disposed over the second structure, wherein the first structure includes one or more first anchors and a first proof mass and the first proof mass is supported by one or more springs each connected to one of the one or more first anchors, and one or more recesses are formed at a bottom of the first proof mass facing the substrate.

7 . The device of claim 6 , wherein each of the one or more springs has a pulse-wave shape in plan view.

8 . The device of claim 6 , wherein the second structure includes a second anchor and a second proof mass,
wherein the second anchor is connected to one of the one or more first anchors by a first via electrode.

9 . The device of claim 8 , wherein the second proof mass is connected to the first proof mass by a second via electrode.

10 . The device of claim 6 , wherein:
the first structure further includes a third via electrode coupled to one of the one or more first anchors different from the one of the one or more first anchors including the first via electrode, and the third via electrode is electrically connected to the substrate.

11 . A device, comprising:
a substrate; a first structure disposed over the substrate; a second structure disposed over the first structure; and a cover disposed over the second structure, wherein the first structure includes: one or more of first anchors, a plurality of first electrodes arranged along a first direction and coupled to one of the one or more first anchors, and a plurality of second electrodes arranged along the first direction and coupled to a first proof mass, and wherein the first electrodes and second electrodes are alternately arranged along the first direction.

12 . The device of claim 11 , wherein the first structure further comprises a plurality of third electrodes arranged along a second direction perpendicular to the first direction and coupled to a second anchor, and a plurality of fourth electrodes arranged along the second direction and coupled to the first proof mass, and
wherein the third electrodes and fourth electrodes are alternately arranged along the second direction.

13 . The device of claim 12 , wherein the second structure includes a third anchor, a second proof mass and a plurality of fifth electrodes coupled to the second anchor.

14 . The device of claim 13 , wherein the third anchor and the first anchor are coupled to the substrate by the first via electrode.

15 . The device of claim 11 , wherein the first proof mass is supported by one or more springs each connected to one of the one or more first anchors.

16 . The device of claim 15 , wherein each of the one or more springs has a pulse-wave shape in plan view.

17 . The device of claim 1 , wherein the proof mass has a frame shape in plan view.

18 . The device of claim 6 , wherein the proof mass has a frame shape in plan view.

19 . The device of claim 11 , wherein the proof mass has a frame shape in plan view.

20 . The device of claim 9 , wherein an area of the first via electrode is greater than an area of the second via electrode.

Assignees

• Taiwan Semiconductor Mfg Company Ltd

Inventors

• Chen Yang-Che
• Liang Victor Chiang
• Lin Chen-Hua
• Liu Chwen-Ming
• Tseng Huang-Wen
• Teng Yi-Chuan

Classifications

• B81B2203/0136

  Comb structures · CPC title

• B81B2201/033

  Comb drives · CPC title

• B81C1/00476

  removing a sacrificial layer (B81C1/00912 takes precedence) · CPC title

• B81C1/00484

  Processes for releasing structures not provided for in group B81C1/00476 · CPC title

• B81C1/00468

  Releasing structures · CPC title