Semiconductor packages
US-2024363472-A1 · Oct 31, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/877 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 6,983 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 603 |
| 2016 | 608 |
| 2017 | 608 |
| 2018 | 569 |
| 2019 | 600 |
| 2020 | 767 |
| 2021 | 737 |
| 2022 | 673 |
| 2023 | 610 |
| 2024 | 608 |
| 2025 | 488 |
| 2026 | 112 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor devices and methods of manufacturing semiconductor devices
US-2024355744-A1 · Oct 24, 2024 · US
Semiconductor device and method of integrating power module with interposer and opposing substrates
US-2024304603-A1 · Sep 12, 2024 · US
Smaller module by stacking
US-2024038743-A1 · Feb 1, 2024 · US
MULTI-COMPONENT MODULES (MCMs) INCLUDING CONFIGURABLE ELECTROMAGNETIC ISOLATION (EMI) SHIELD STRUCTURES AND RELATED METHODS
US-2024021538-A1 · Jan 18, 2024 · US
Multiple bond via arrays of different wire heights on a same substrate
US-2015380377-A1 · Dec 31, 2015 · US
Heat spreading layer with high thermal conductivity
US-2015371919-A1 · Dec 24, 2015 · US
Silicon shield for package stress sensitive devices
US-2015364431-A1 · Dec 17, 2015 · US
Reconfigured wide i/o memory modules and package architectures using same
US-2015364454-A1 · Dec 17, 2015 · US
Mounting apparatus and mounting method for flip chip bonding semiconductor chips using two-step pressing process
US-9209051-B2 · Dec 8, 2015 · US
Wire bond support structure and microelectronic package including wire bonds therefrom
US-2015348928-A1 · Dec 3, 2015 · US
Methods of fabricating fan-out wafer level packages and packages formed by the methods
US-9202716-B2 · Dec 1, 2015 · US
Method for manufacturing light emitting device and light emitting device
US-2015340577-A1 · Nov 26, 2015 · US
Semiconductor device and method of forming adhesive layer over insulating layer for bonding carrier to mixed surfaces of semiconductor die and encapsulant
US-9184104-B1 · Nov 10, 2015 · US
Devices and systems comprising drivers for power conversion circuits
US-2015318851-A1 · Nov 5, 2015 · US
Reconstitution techniques for semiconductor packages
US-2015303172-A1 · Oct 22, 2015 · US
Integrated electronic device with transceiving antenna and magnetic interconnection
US-2015294946-A1 · Oct 15, 2015 · US
CPU with stacked memory
US-9158344-B2 · Oct 13, 2015 · US
Matrix lid heatspreader for flip chip package
US-9159643-B2 · Oct 13, 2015 · US
Semiconductor device having a semiconductor chip mounted on an insulator film and coupled with a wiring layer, and method for manufacturing the same
US-9153541-B2 · Oct 6, 2015 · US
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/877?
- CPC H10W72/877 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H10W72/877 (Electricity)?
- Our database includes 6,983 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/877 growing?
- Publication counts under this code: 608 in 2024 vs 488 in 2025 (latest complete years).