Interposer having inductor coil pattern embedded in buffer layer and fabrication thereof
US-12598998-B2 · Apr 7, 2026 · US
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Lin da-jun patents
Lin da-jun is listed as an inventor on 147 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lin da-jun |
| Total patents | 147 |
| First publication | Nov 21, 2019 |
| Latest publication | Apr 7, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor device
US-2026096169-A1 · Apr 2, 2026 · US
Semiconductor structure and fabrication method thereof
US-2026090346-A1 · Mar 26, 2026 · US
Semiconductor structure including resistive random access memory and double capacitor and manufacturing method thereof
US-2026076106-A1 · Mar 12, 2026 · US
Semiconductor structure with magnetic tunnel junction and inductor
US-2026060007-A1 · Feb 26, 2026 · US
Semiconductor device and method for manufacturing the same
US-2026059819-A1 · Feb 26, 2026 · US
Method for forming ohmic contacts on compound semiconductor devices
US-12563800-B2 · Feb 24, 2026 · US
Semiconductor device and manufacturing method thereof
US-12538540-B2 · Jan 27, 2026 · US
MIM capacitor and fabricating method of the same
US-12532485-B2 · Jan 20, 2026 · US
Structure with mram and inductor and fabricating method of the same
US-2026007076-A1 · Jan 1, 2026 · US
Recent patents
Latest publications not already listed above.
Mim capacitor structure and fabricating method of the same
US-2025386526-A1 · Dec 18, 2025 · US
Semiconductor device including iii-v compound semiconductor layer
US-2025386531-A1 · Dec 18, 2025 · US
Semiconductor device and method for manufacturing the same
US-12501678-B2 · Dec 16, 2025 · US
Mim capacitor structure and fabricating method of the same
US-2025374565-A1 · Dec 4, 2025 · US
Capacitor structure and manufacturing method thereof
US-2025374566-A1 · Dec 4, 2025 · US
Manufacturing method of semiconductor device including iii-v compound semiconductor layer
US-2025374579-A1 · Dec 4, 2025 · US
Structure with photodiode, high electron mobility transistor, surface acoustic wave device and fabricating method of the same
US-2025364515-A1 · Nov 27, 2025 · US
Mram structure and fabricating method of the same
US-2025351376-A1 · Nov 13, 2025 · US
Semiconductor structure and the forming method thereof
US-2025331216-A1 · Oct 23, 2025 · US
Tsv structure and fabricating method of the same
US-2025329613-A1 · Oct 23, 2025 · US
Method for forming semiconductor structure
US-2025324646-A1 · Oct 16, 2025 · US
Semiconductor device and manufacturing method thereof
US-2025316621-A1 · Oct 9, 2025 · US
MIM capacitor structure and fabricating method of the same
US-12432946-B2 · Sep 30, 2025 · US
Compound semiconductor device and fabrication method thereof
US-12432995-B2 · Sep 30, 2025 · US
Semiconductor device including III-V compound semiconductor layer and manufacturing method thereof
US-12419070-B2 · Sep 16, 2025 · US
Structure with photodiode, high electron mobility transistor, surface acoustic wave device and fabricating method of the same
US-12406973-B2 · Sep 2, 2025 · US
Method for fabricating semiconductor device
US-2025268108-A1 · Aug 21, 2025 · US
MRAM structure and fabricating method of the same
US-12389606-B2 · Aug 12, 2025 · US
Embedded memory device and fabrication method thereof
US-2025248048-A1 · Jul 31, 2025 · US
Semiconductor structure and the forming method thereof
US-12376323-B2 · Jul 29, 2025 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| United Microelectronics Corp | 147 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10N50/01 | 46 |
| H10N50/10 | 45 |
| H10B61/00 | 41 |
| H10N50/80 | 41 |
| H10D62/8503 | 30 |