Thin-film structure and semiconductor device comprising the same
US-12573522-B2 · Mar 10, 2026 · US
Lee Eunha is listed as an inventor on 34 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Eunha |
| Total patents | 34 |
| First publication | Sep 12, 2019 |
| Latest publication | Mar 10, 2026 |
Publications ranked by popularity score, then publication date.
US-12573522-B2 · Mar 10, 2026 · US
US-12568660-B2 · Mar 3, 2026 · US
US-12527038-B2 · Jan 13, 2026 · US
US-12487196-B2 · Dec 2, 2025 · US
US-2025331242-A1 · Oct 23, 2025 · US
US-12441198-B2 · Oct 14, 2025 · US
US-12382670-B2 · Aug 5, 2025 · US
US-2025220979-A1 · Jul 3, 2025 · US
US-12077853-B2 · Sep 3, 2024 · US
US-12034036-B2 · Jul 9, 2024 · US
Latest publications not already listed above.
US-2024194761-A1 · Jun 13, 2024 · US
US-11935916-B2 · Mar 19, 2024 · US
US-11848366-B2 · Dec 19, 2023 · US
US-2023286391-A1 · Sep 14, 2023 · US
US-2023282389-A1 · Sep 7, 2023 · US
US-2023268385-A1 · Aug 24, 2023 · US
US-11676999-B2 · Jun 13, 2023 · US
US-2023154973-A1 · May 18, 2023 · US
US-2023122101-A1 · Apr 20, 2023 · US
US-2023062878-A1 · Mar 2, 2023 · US
US-2023068904-A1 · Mar 2, 2023 · US
US-11569341-B2 · Jan 31, 2023 · US
US-2022254870-A1 · Aug 11, 2022 · US
US-2022140067-A1 · May 5, 2022 · US
US-2022140147-A1 · May 5, 2022 · US
US-2021408255-A1 · Dec 30, 2021 · US
US-2021388488-A1 · Dec 16, 2021 · US
US-11150170-B2 · Oct 19, 2021 · US
US-11145731-B2 · Oct 12, 2021 · US
US-2021193811-A1 · Jun 24, 2021 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 32 |
| Research & Business Found Sungkyunkwan Univ | 4 |
| Hl Mando Corp | 2 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D64/689 | 18 |
| H10D30/701 | 18 |
| H10D1/68 | 16 |
| H10D64/033 | 13 |
| H10D1/684 | 12 |