Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-12516139-B2 · Jan 6, 2026 · US
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Kumazawa Yune patents
Kumazawa Yune is listed as an inventor on 22 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kumazawa Yune |
| Total patents | 22 |
| First publication | Jul 8, 2021 |
| Latest publication | Jan 6, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-12312323-B2 · May 27, 2025 · US
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-12221523-B2 · Feb 11, 2025 · US
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-12133339-B2 · Oct 29, 2024 · US
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-2024309127-A1 · Sep 19, 2024 · US
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-2024287347-A1 · Aug 29, 2024 · US
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-2024287219-A1 · Aug 29, 2024 · US
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-2024279432-A1 · Aug 22, 2024 · US
Compound and method for producing the same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-11767287-B2 · Sep 26, 2023 · US
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-11680139-B2 · Jun 20, 2023 · US
Recent patents
Latest publications not already listed above.
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-11643493-B2 · May 9, 2023 · US
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-2023066153-A1 · Mar 2, 2023 · US
Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-2023062796-A1 · Mar 2, 2023 · US
Compound and method for producing the same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-2023057045-A1 · Feb 23, 2023 · US
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-11466123-B2 · Oct 11, 2022 · US
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-11447658-B2 · Sep 20, 2022 · US
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-2022204694-A1 · Jun 30, 2022 · US
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-2022204695-A1 · Jun 30, 2022 · US
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-2022204810-A1 · Jun 30, 2022 · US
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-11370857-B2 · Jun 28, 2022 · US
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-2022071025-A1 · Mar 3, 2022 · US
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-2021206892-A1 · Jul 8, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Mitsubishi Gas Chemical Co | 22 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C08F2/50 | 18 |
| H05K1/0346 | 15 |
| C08G73/12 | 14 |
| H05K1/03 | 14 |
| C08F222/40 | 12 |