US11370857B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11370857-B2 |
| Application number | US-201917271745-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 28, 2019 |
| Priority date | Aug 30, 2018 |
| Publication date | Jun 28, 2022 |
| Grant date | Jun 28, 2022 |
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A resin composition of the present invention contains: a maleimide compound (A) having a maleimide functional group equivalent of 300 g/eq. or more, and a transmittance of 1% or more at a wavelength of 405 nm (h-line); a maleimide compound (B) having a maleimide functional group equivalent of less than 300 g/eq.; and a photo initiator (C) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line).
Opening claim text (preview).
The invention claimed is: 1. A resin composition comprising: a maleimide compound (A) having a maleimide functional group equivalent of 300 g/eq. or more, and a transmittance of 1% or more at a wavelength of 405 nm (h-line); a maleimide compound (B) having a maleimide functional group equivalent of less than 300 g/eq.; a photo initiator (C) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line), wherein the resin composition is light-sensitive and photocurable when exposed with an active energy ray at a wavelength of 405 nm (h-line), wherein a compounding ratio between the maleimide compound (A) and the maleimide compound (B) ((A):(B)) is 5 to 95:95 to 5 on a mass basis wherein the photo initiator (C) is a compound represented by the following formula (1): wherein each R 1 independently represents a substituent represented by the following formula (2) or a phenyl group: wherein, -* shows a bonding site, and each R 2 independently represents a hydrogen atom or a methyl group. 2. The resin composition according to claim 1 , wherein a content of the maleimide compound (A) and the maleimide compound (B) is 50 to 99.9 parts by mass based on 100 parts by mass in total of the maleimide compound (A), the maleimide compound (B), and the photo initiator (C). 3. A resin sheet comprising: a support; and a resin layer disposed on one surface or both surfaces of the support, wherein the resin layer comprises the resin composition according to claim 1 . 4. The resin sheet according to claim 3 , wherein the resin layer has a thickness of 1 to 50 μm. 5. A multilayer printed wiring board comprising the resin composition according to claim 1 . 6. A semiconductor device comprising the resin composition according to claim 1 .
containing N · CPC title
Photodevelopable thick film, e.g. conductive or insulating paste · CPC title
with photosensitivity-increasing substances, e.g. photoinitiators · CPC title
Unsaturated polyimide precursors · CPC title
Photosensitive materials (G03F7/12, G03F7/14 take precedence) · CPC title
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