Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device

Patent metadata

Field	Value
Publication number	US-11643493-B2
Application number	US-202017784281-A
Country	US
Kind code	B2
Filing date	Dec 9, 2020
Priority date	Dec 11, 2019
Publication date	May 9, 2023
Grant date	May 9, 2023

Abstract

Provided is a resin composition which has good solubility and photocurability, further has good alkaline-developability when containing a photo initiator and a compound containing one or more carboxyl groups, and in addition, is capable of providing a resin sheet having suppressed tackiness; and a resin sheet, multilayer printed wiring board, and semiconductor device using the same. The resin composition of the present invention contains a particular bismaleimide compound (A), and at least two maleimide compounds (B) selected from the group consisting of six kinds of particular compounds which are different from this bismaleimide compound (A).

First claim

The invention claimed is:

1. A resin composition comprising:
a bismaleimide compound (A) comprising a constituent unit represented by the following formula (1), and maleimide groups at both ends of the molecular chain,
at least two maleimide compounds (B) selected from the group consisting of a compound represented by the following formula (2), a compound represented by the following formula (3), a compound represented by the following formula (4), a compound represented by the following formula (5), a compound represented by the following formula (6), and a compound represented by the following formula (7),
a photo initiator (C) and
a compound (D) comprising one or more carboxy groups:

wherein R 1 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; R 2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; each R 3 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms; and each n 1 independently represents an integer of 1 to 10,

wherein each of R 4 , R 5 , and R 6 independently represents a hydrogen atom, a hydroxyl group, or a linear or branched alkyl group having 1 to 6 carbon atoms and optionally having a substituent; and n 2 represents an integer of 1 to 10,

wherein each R 7 independently represents a hydrogen atom or a methyl group; and n 3 represents an integer of 1 to 10,

wherein each of R 8 , R 9 , and R 10 independently represents a hydrogen atom, or a linear or branched alkyl group having 1 to 8 carbon atoms and optionally having a substituent,

wherein each R 11 independently represents a hydrogen atom, a methyl group, or an ethyl group; and each R 12 independently represents a hydrogen atom or a methyl group,

wherein each R 13 independently represents a hydrogen atom, a methyl group, or an ethyl group, and

wherein each R 14 independently represents a hydrogen atom or a methyl group; and n 4 represents an integer of 1 to 10.

2. The resin composition according to claim 1 , wherein the photo initiator (C) comprises a compound represented by the following formula (8):

wherein each R 15 independently represents a group represented by the following formula (9) or a phenyl group; and

wherein -* represents a bonding hand, and each R 16 independently represents a hydrogen atom or a methyl group.

3. The resin composition according to claim 1 , wherein the compound (D) comprising one or more carboxy groups is at least one selected from the group consisting of a compound represented by the following formula (10), a compound represented by the following formula (11), a compound represented by the following formula (12), and a compound represented by the following formula (13):

wherein each R 17 independently represents a hydrogen atom, a hydroxyl group, a carboxy group, an amino group or an aminomethyl group; each k independently represents an integer of 1 to 5; and when two or more carboxy groups are present, the carboxy groups are optionally linked together to form an acid anhydride,

wherein each R 18 independently represents a hydrogen atom, a hydroxyl group, a carboxy group, a carboxymethyl group, an amino group or an aminomethyl group; each 1 independently represents an integer of 1 to 9; when two or more carboxy groups are present, the carboxy groups are optionally linked together to form an acid anhydride; and when a carboxymethyl group is present, the carboxymethyl group and the carboxy group are optionally linked together to form an acid anhydride,

wherein each R 19 independently represents a hydrogen atom, a hydroxyl group, a carboxy group, a carboxymethyl group, an amino group or an aminomethyl group; each m independently represents an integer of 1 to 9; when two or more carboxy groups are present, the carboxy groups are optionally linked together to form an acid anhydride; and when a carboxymethyl group is present, the carboxymethyl group and the carboxy group are optionally linked together to form an acid anhydride, and

wherein each R 20 independently represents a hydrogen atom, a hydroxyl group, a carboxy group, a carboxymethyl group, an amino group or an aminomethyl group; each o independently represents an integer of 1 to 5; when one or more carboxy groups are present, the carboxymethyl group and the carboxy group are optionally linked together to form an acid anhydride; when two or more carboxy groups are present, the carboxy groups are optionally linked together to form an acid anhydride; and when two or more carboxymethyl groups are present, the carboxymethyl groups are optionally linked together to form an acid anhydride.

4. A resin sheet comprising:
a support; and
a resin layer disposed on one surface or both surfaces of the support,
wherein the resin layer comprises the resin composition according to claim 1 .

5. The resin sheet according to claim 4 , wherein the resin layer has a thickness of 1 to 50 μm.

6. A multilayer printed wiring board comprising:
an insulation layer; and
a conductor layer formed on one surface or both surfaces of the insulation layer,
wherein the conductor layer comprises the resin composition according to claim 1 .

7. A semiconductor device comprising the resin composition according to claim 1 .

Assignees

• Mitsubishi Gas Chemical Co

Inventors

• Kumazawa Yune
• Suzuki Takuya
• Shika Seiji
• Katagiri Shunsuke

Classifications

• C08K5/53

  bound to oxygen and to carbon only · CPC title

• C08K5/101

  of monocarboxylic acids · CPC title

• C08G73/12

  Unsaturated polyimide precursors · CPC title

• H05K1/0298

  Multilayer circuits · CPC title

• H05K1/0346

  containing N · CPC title