Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device

Patent metadata

Field	Value
Publication number	US-12221523-B2
Application number	US-202218570322-A
Country	US
Kind code	B2
Filing date	Jun 14, 2022
Priority date	Jun 15, 2021
Publication date	Feb 11, 2025
Grant date	Feb 11, 2025

Abstract

An object of the present invention is to provide a resin composition which has excellent photocurability for various active energy rays without inhibiting photocuring reaction in an exposure step, and can confer excellent alkaline developability in a development step, when used in the fabrication of a multilayer printed wiring board, while the resulting insulation layer has excellent adhesiveness to an adhesive metal such as titanium; and a resin sheet, a multilayer printed wiring board, and a semiconductor device. The resin composition of the present invention is a resin composition containing: a bismaleimide compound (A) containing a constituent unit represented by the following formula (1), and maleimide groups at both ends of the molecular chain; and an imidazole compound (B) represented by the following formula (2):

First claim

The invention claimed is:

1. A resin composition comprising:
a bismaleimide compound (A) comprising a constituent unit represented by the following formula (1), and maleimide groups at both ends of the molecular chain;
an imidazole compound (B);
a compound (C) comprising one or more carboxy groups; and
a photo initiator (E),
wherein the imidazole compound (B) comprises at least one or more selected from the group consisting of 2-undecylimidazole, 1-(2-cyanoethyl)-2-undecylimidazole, and 2,4,5-triphenylimidazole,
wherein the content of the bismaleimide compound (A) is 30 to 80 parts by mass based on 100 parts by mass of the resin solid content in the resin composition,
wherein the content of the imidazole compound (B) is 0.3 to 10 parts by mass based on 100 parts by mass of the resin solid content in the resin composition, and
wherein the content of the photo initiator (E) is 0.1 to 10 parts by mass based on 100 parts by mass of the resin solid content in the resin composition:

wherein R 1 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; R 2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; each R 3 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms; and each n 1 independently represents an integer of 1 to 10,
wherein the compound (C) comprising one or more carboxy groups comprises a compound represented by the following formula (3):

wherein each R 8 independently represents a group represented by the following formula (4) or a hydrogen atom; and each R 9 independently represents a hydrogen atom, or a linear or branched alkyl group having 1 to 6 carbon atoms, provided that at least one R 8 is a group represented by the following formula (4);

wherein -* represents a bonding hand.

2. The resin composition according to claim 1 , further comprising at least one maleimide compound (D) selected from the group consisting of a compound represented by the following formula (5), a compound represented by the following formula (6), a compound represented by the following formula (7), a compound represented by the following formula (8), a compound represented by the following formula (9), and a compound represented by the following formula (10):

wherein each of R 10 , R 11 , and R 12 independently represents a hydrogen atom, or a linear or branched alkyl group having 1 to 8 carbon atoms and optionally having a substituent,

wherein each of R 13 , R 14 , and R 15 independently represents a hydrogen atom, a hydroxy group, or a linear or branched alkyl group having 1 to 6 carbon atoms and optionally having a substituent; and n 2 represents an integer of 1 to 10,

wherein each R 16 independently represents a hydrogen atom, a methyl group, or an ethyl group; and each R 17 independently represents a hydrogen atom or a methyl group,

wherein each R 18 independently represents a hydrogen atom or a methyl group; and n 3 represents an integer of 1 to 10,

wherein each R 19 independently represents a hydrogen atom, a methyl group, or an ethyl group, and

wherein each R 20 independently represents a hydrogen atom or a methyl group; and n 4 represents an integer of 1 to 10.

3. A resin sheet comprising:
a support; and
a resin layer disposed on one surface or both surfaces of the support,
wherein the resin layer comprises the resin composition according to claim 1 .

4. The resin sheet according to claim 3 , wherein the resin layer has a thickness of 1 to 50 μm.

5. A multilayer printed wiring board comprising:
an insulation layer; and
a conductor layer formed on one surface or both surfaces of the insulation layer,
wherein the insulation layer comprises the resin composition according to claim 1 .

6. A semiconductor device comprising the resin composition according to claim 1 .

Assignees

• Mitsubishi Gas Chemical Co

Inventors

• Kumazawa Yune
• Katagiri Shunsuke
• Suzuki Takuya

Classifications

• H05K1/0346

  containing N · CPC title

• G03F7/029

  Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur · CPC title

• C08F22/40 Primary

  Imides, e.g. cyclic imides · CPC title

• H05K3/46

  Manufacturing multilayer circuits · CPC title

• H05K1/03

  Use of materials for the substrate · CPC title