Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device

Patent metadata

Field	Value
Publication number	US-12516139-B2
Application number	US-202218567523-A
Country	US
Kind code	B2
Filing date	Jun 14, 2022
Priority date	Jun 15, 2021
Publication date	Jan 6, 2026
Grant date	Jan 6, 2026

Abstract

An object of the present invention is to provide a resin composition which has excellent photocurability for various active energy rays, in particular, an active energy ray including an h-line at a wavelength of 405 nm, without inhibiting photocuring reaction in an exposure step, and can confer excellent alkaline developability in a development step, when used in the fabrication of a multilayer printed wiring board; and a resin sheet, a multilayer printed wiring board, and a semiconductor device. The resin composition of the present invention is a resin composition containing: a maleimide compound (A) containing a constituent unit represented by the formula (1), and maleimide groups at both ends of the molecular chain; a photo initiator (B1) represented by the formula (2) and/or a photo initiator (B2) represented by the formula (3); and a photo initiator (C) represented by the formula (4):

First claim

The invention claimed is:

1 . A resin composition comprising:
a maleimide compound (A) comprising a constituent unit represented by the following formula (1), and maleimide groups at both ends of the molecular chain; a photo initiator (B1) represented by the following formula (2) and/or a photo initiator (B2) represented by the following formula (3); and a photo initiator (C) represented by the following formula (4):

wherein R 1 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; R 2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; each R 3 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms; and each n 1 independently represents an integer of 1 to 10,

wherein R 4 represents an acetyl group or a benzoyl group; R 5 represents a phenyl group or naphthyl group optionally having a substituent; R 6 represents a hydrogen atom, or a linear or branched alkyl group having 1 to 16 carbon atoms and optionally having a substituent; each R 7 independently represents a hydrogen atom, or a linear or branched alkyl group having 1 to 6 carbon atoms and optionally having a substituent; and each n 2 independently represents an integer of 1 to 5,

wherein R 8 represents an aryl group having 6 to 24 carbon atoms and optionally having a substituent, or a heteroaryl group having 3 to 24 carbon atoms and optionally having a substituent; R 9 represents an acetyl group or a benzoyl group; R 10 represents a hydrogen atom, or a linear or branched alkyl group having 1 to 16 carbon atoms and optionally having a substituent; and X represents an oxygen atom or a sulfur atom,

wherein each R 11 independently represents a group represented by the following formula (5) or a phenyl group:

wherein —* represents a bonding site, and each R 12 independently represents a hydrogen atom or a methyl group.

2 . The resin composition according to claim 1 , further comprising a compound (D) comprising one or more carboxy groups.

3 . The resin composition according to claim 2 , wherein the compound (D) comprising one or more carboxy groups comprises a compound represented by the following formula (6):

wherein each R 13 independently represents a group represented by the following formula (7) or a hydrogen atom; and each R 14 independently represents a hydrogen atom, or a linear or branched alkyl group having 1 to 6 carbon atoms, provided that at least one R 13 is a group represented by the following formula (7):

wherein —* represents a bonding site.

4 . The resin composition according to claim 1 , further comprising at least one maleimide compound (E) selected from the group consisting of a compound represented by the following formula (8), a compound represented by the following formula (9), a compound represented by the following formula (10), a compound represented by the following formula (11), a compound represented by the following formula (12), and a compound represented by the following formula (13):

wherein each of R 15 , R 16 , and R 17 independently represents a hydrogen atom, or a linear or branched alkyl group having 1 to 8 carbon atoms and optionally having a substituent,

wherein each of R 18 , R 19 , and R 20 independently represents a hydrogen atom, a hydroxy group, or a linear or branched alkyl group having 1 to 6 carbon atoms and optionally having a substituent; and n 2 represents an integer of 1 to 10,

wherein each R 21 independently represents a hydrogen atom, a methyl group, or an ethyl group; and each R 22 independently represents a hydrogen atom or a methyl group,

wherein each R 23 independently represents a hydrogen atom or a methyl group; and n 3 represents an integer of 1 to 10,

wherein each R 24 independently represents a hydrogen atom, a methyl group, or an ethyl group,

wherein each R 25 independently represents a hydrogen atom or a methyl group; and n 4 represents an integer of 1 to 10.

5 . A resin sheet comprising:
a support; and a resin layer disposed on one surface or both surfaces of the support, wherein the resin layer comprises the resin composition according to claim 1 .

6 . The resin sheet according to claim 5 , wherein the resin layer has a thickness of 1 to 50 μm.

7 . A multilayer printed wiring board comprising:
an insulation layer; and a conductor layer formed on one surface or both surfaces of the insulation layer, wherein the insulation layer comprises the resin composition according to claim 1 .

8 . A semiconductor device comprising the resin composition according to claim 1 .

Assignees

• Mitsubishi Gas Chemical Co

Inventors

• Kumazawa Yune
• Suzuki Takuya
• Katagiri Shunsuke

Classifications

• H05K1/03 Primary

  Use of materials for the substrate · CPC title

• B32B2307/206

  Insulating · CPC title

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title

• B32B27/281

  comprising polyimides · CPC title

• B32B15/08

  of synthetic resin · CPC title