Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device

Patent metadata

Field	Value
Publication number	US-11447658-B2
Application number	US-202017621918-A
Country	US
Kind code	B2
Filing date	Jun 26, 2020
Priority date	Jun 28, 2019
Publication date	Sep 20, 2022
Grant date	Sep 20, 2022

Abstract

The resin composition of the present invention contains a maleimide compound (A) represented by the following formula (1); and a photo initiator (B) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line).

In the formula (1), R 1 , R 2 , and R 3 each independently represent an alkyl group or an alkoxy group which may have a hydrogen atom, a halogen atom, a hydroxyl group, or a substituent, R 4 represents an alkylene group, an alkenylene group, an alkoxylene group, or an arylene group which may have a substituent, and R 5 and R 6 each independently represent a hydrogen atom, a linear or branched alkyl group having 1 to 6 carbon atoms, or a linear or branched alkenyl group having 1 to 6 carbon atoms.

First claim

The invention claimed is:

1. A resin composition comprising:
a maleimide compound (A) represented by the following formula (1);
a photo initiator (B) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line); and
a maleimide compound represented by the following formula (18);
wherein a content of the maleimide compound (A) is 10 to 95 parts by mass based on 100 parts by mass of the resin solid content in the resin composition, and
wherein a content of the maleimide compound represented by the following formula (18) is 5 to 90 parts by mass based on 100 parts by mass of the resin solid content in the resin composition:

wherein R 1 , R 2 , and R 3 each independently represent an alkyl group or an alkoxy group which may have a hydrogen atom, a halogen atom, a hydroxyl group, or a substituent, R 4 represents an alkylene group, an alkenylene group, an alkoxylene group, or an arylene group which may have a substituent, and R 5 and R 6 each independently represent a hydrogen atom, a linear alkyl group having 1 to 6 carbon atoms, a branched alkyl group having 3 to 6 carbon atoms, a linear alkenyl group having 1 to 6 carbon atoms, or a branched alkenyl group having 4 to 6 carbon atoms; and

wherein n7 represents an integer of 1 to 10.

2. The resin composition according to claim 1 , wherein the maleimide compound (A) comprises a compound represented by the following formula (2):

3. The resin composition according to claim 1 , wherein a content of the maleimide compound (A) is 50 to 99.9 parts by mass based on 100 parts by mass in total of the maleimide compound (A) and the photo initiator (B).

4. The resin composition according to claim 1 , wherein the photo initiator (B) comprises a compound represented by the following formula (3):

wherein each R 7 independently represents a substituent represented by the following formula (4) or a phenyl group; and

wherein -* represents a bonding hand, and each R 8 independently represents a hydrogen atom or a methyl group.

5. A resin sheet comprising:
a support; and
a resin layer disposed on one surface or both surfaces of the support,
wherein the resin layer comprises the resin composition according to claim 1 .

6. The resin sheet according to claim 5 , wherein the resin layer has a thickness of 1 to 50 μm.

7. A multilayer printed wiring board comprising:
an insulation layer; and
a conductor layer formed on one surface or both surfaces of the insulation layer,
wherein the insulation layer comprises the resin composition according to claim 1 .

8. A semiconductor device comprising the resin composition according to claim 1 .

Assignees

• Mitsubishi Gas Chemical Co

Inventors

• Katagiri Shunsuke
• Suzuki Takuya
• Shika Seiji
• Kumazawa Yune

Classifications

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• B32B2255/10

  on synthetic resin layer or on natural or synthetic rubber layer · CPC title

• B32B15/09

  comprising polyesters · CPC title

• B32B27/36

  comprising polyesters · CPC title

• B32B2255/26

  Polymeric coating · CPC title