Compound and method for producing the same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device

US11767287B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11767287-B2
Application numberUS-202017784163-A
CountryUS
Kind codeB2
Filing dateDec 9, 2020
Priority dateDec 11, 2019
Publication dateSep 26, 2023
Grant dateSep 26, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A compound (A) of the present invention is represented by the formula (1): wherein each R 1 independently represents a group represented by the formula (2) or a hydrogen atom, and each R 2 independently represents a hydrogen atom or a linear or branched alkyl group having 1 to 6 carbon atoms, provided that at least one R 1 is a group represented by the formula (2); and wherein -* represents a bonding hand.

First claim

Opening claim text (preview).

The invention claimed is: 1. A compound represented by the following formula (17): 2. A method for producing the compound according to claim 1 , comprising a step of reacting an alcohol compound represented by the following formula (4) with an acid anhydride represented by the following formula (6): wherein each R 3 independently represents an ethyl group. 3. The production method according to claim 2 , wherein the reaction is carried out in the absence of a catalyst. 4. The production method according to claim 2 , wherein the reaction is performed in at least one solvent selected from the group consisting of a halogen solvent, a ketone solvent, and an ester solvent. 5. The production method according to claim 4 , wherein the solvent is at least one selected from the group consisting of dichloromethane, methyl ethyl ketone, butyl acetate, γ-butyrolactone, and propylene glycol monomethyl ether acetate. 6. A resin composition comprising a compound represented by the following formula (16) and/or a compound represented by the following formula (17): and a bismaleimide compound (B) comprising a constituent unit represented by the following formula (7) and maleimide groups at both ends of the molecular chain: wherein R 4 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; R 5 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; each R 6 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms; and each n 1 independently represents an integer of 1 to 10. 7. The resin composition according to claim 6 , further comprising at least one maleimide compound (C) selected from the group consisting of a compound represented by the following formula (8), a compound represented by the following formula (9), a compound represented by the following formula (10), a compound represented by the following formula (11), a compound represented by the following formula (12), and a compound represented by the following formula (13): wherein R 7 , R 8 , and R 9 each independently represent a hydrogen atom, or a linear or branched alkyl group having 1 to 8 carbon atoms and optionally having a substituent; wherein R 10 , R 11 , and R 12 each independently represent a hydrogen atom, a hydroxyl group, or a linear or branched alkyl group having 1 to 6 carbon atoms and optionally having a substituent; and n 2 is an integer of 1 to 10; wherein each R 13 independently represents a hydrogen atom, a methyl group or an ethyl group, and each R 14 independently represents a hydrogen atom or a methyl group; wherein each R 15 independently represents a hydrogen atom or a methyl group; and n 3 is an integer of 1 to 10; wherein each R 16 independently represents a hydrogen atom, a methyl group or an ethyl group; and wherein each R 17 independently represents a hydrogen atom or a methyl group; and n 4 is an integer of 1 to 10. 8. The resin composition according to claim 6 , further comprising a photo initiator (D). 9. The resin composition according to claim 8 , wherein the photo initiator (D) comprises a compound represented by the following formula (14): wherein each R 18 independently represents a group represented by the following formula (15) or a phenyl group; and wherein -* represents a bonding hand, and each R 19 independently represents a hydrogen atom or a methyl group. 10. A resin sheet comprising: a support; and a resin layer disposed on one surface or both surfaces of the support, wherein the resin layer comprises the resin composition according to claim 6 . 11. The resin sheet according to claim 10 , wherein the resin layer has a thickness of 1 to 50 μm. 12. A multilayer printed wiring board comprising: an insulation layer; and a conductor layer formed on one surface or both surfaces of the insulation layer, wherein the insulation layer comprises the resin composition according to claim 6 . 13. A semiconductor device comprising the resin composition according to claim 6 .

Assignees

Inventors

Classifications

  • C07C69/75Primary

    of acids with a six-membered ring · CPC title

  • Unsaturated polyimide precursors · CPC title

  • Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion · CPC title

  • The ring being saturated · CPC title

  • Organic insulating material · CPC title

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What does patent US11767287B2 cover?
A compound (A) of the present invention is represented by the formula (1): wherein each R 1 independently represents a group represented by the formula (2) or a hydrogen atom, and each R 2 independently represents a hydrogen atom or a linear or branched alkyl group having 1 to 6 carbon atoms, provided that at least one R 1 is a group represented by the formula (2); and wherein -* represents …
Who is the assignee on this patent?
Mitsubishi Gas Chemical Co
What technology area does this patent fall under?
Primary CPC classification C07C69/75. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 26 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).