Resin composition, wiring layer laminate for semiconductor, and semiconductor device
US-2019281697-A1 · Sep 12, 2019 · US
US11767287B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11767287-B2 |
| Application number | US-202017784163-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 9, 2020 |
| Priority date | Dec 11, 2019 |
| Publication date | Sep 26, 2023 |
| Grant date | Sep 26, 2023 |
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A compound (A) of the present invention is represented by the formula (1): wherein each R 1 independently represents a group represented by the formula (2) or a hydrogen atom, and each R 2 independently represents a hydrogen atom or a linear or branched alkyl group having 1 to 6 carbon atoms, provided that at least one R 1 is a group represented by the formula (2); and wherein -* represents a bonding hand.
Opening claim text (preview).
The invention claimed is: 1. A compound represented by the following formula (17): 2. A method for producing the compound according to claim 1 , comprising a step of reacting an alcohol compound represented by the following formula (4) with an acid anhydride represented by the following formula (6): wherein each R 3 independently represents an ethyl group. 3. The production method according to claim 2 , wherein the reaction is carried out in the absence of a catalyst. 4. The production method according to claim 2 , wherein the reaction is performed in at least one solvent selected from the group consisting of a halogen solvent, a ketone solvent, and an ester solvent. 5. The production method according to claim 4 , wherein the solvent is at least one selected from the group consisting of dichloromethane, methyl ethyl ketone, butyl acetate, γ-butyrolactone, and propylene glycol monomethyl ether acetate. 6. A resin composition comprising a compound represented by the following formula (16) and/or a compound represented by the following formula (17): and a bismaleimide compound (B) comprising a constituent unit represented by the following formula (7) and maleimide groups at both ends of the molecular chain: wherein R 4 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; R 5 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; each R 6 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms; and each n 1 independently represents an integer of 1 to 10. 7. The resin composition according to claim 6 , further comprising at least one maleimide compound (C) selected from the group consisting of a compound represented by the following formula (8), a compound represented by the following formula (9), a compound represented by the following formula (10), a compound represented by the following formula (11), a compound represented by the following formula (12), and a compound represented by the following formula (13): wherein R 7 , R 8 , and R 9 each independently represent a hydrogen atom, or a linear or branched alkyl group having 1 to 8 carbon atoms and optionally having a substituent; wherein R 10 , R 11 , and R 12 each independently represent a hydrogen atom, a hydroxyl group, or a linear or branched alkyl group having 1 to 6 carbon atoms and optionally having a substituent; and n 2 is an integer of 1 to 10; wherein each R 13 independently represents a hydrogen atom, a methyl group or an ethyl group, and each R 14 independently represents a hydrogen atom or a methyl group; wherein each R 15 independently represents a hydrogen atom or a methyl group; and n 3 is an integer of 1 to 10; wherein each R 16 independently represents a hydrogen atom, a methyl group or an ethyl group; and wherein each R 17 independently represents a hydrogen atom or a methyl group; and n 4 is an integer of 1 to 10. 8. The resin composition according to claim 6 , further comprising a photo initiator (D). 9. The resin composition according to claim 8 , wherein the photo initiator (D) comprises a compound represented by the following formula (14): wherein each R 18 independently represents a group represented by the following formula (15) or a phenyl group; and wherein -* represents a bonding hand, and each R 19 independently represents a hydrogen atom or a methyl group. 10. A resin sheet comprising: a support; and a resin layer disposed on one surface or both surfaces of the support, wherein the resin layer comprises the resin composition according to claim 6 . 11. The resin sheet according to claim 10 , wherein the resin layer has a thickness of 1 to 50 μm. 12. A multilayer printed wiring board comprising: an insulation layer; and a conductor layer formed on one surface or both surfaces of the insulation layer, wherein the insulation layer comprises the resin composition according to claim 6 . 13. A semiconductor device comprising the resin composition according to claim 6 .
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