Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device

Patent metadata

Field	Value
Publication number	US-12133339-B2
Application number	US-202017424229-A
Country	US
Kind code	B2
Filing date	Jan 17, 2020
Priority date	Jan 22, 2019
Publication date	Oct 29, 2024
Grant date	Oct 29, 2024

Abstract

A resin composition of the present invention contains: a maleimide compound (A) having a transmittance of 5% or more at a wavelength of 405 nm (h-line); a particular carboxylic acid containing compound (B); and a photo initiator (C) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line).

First claim

The invention claimed is:

1. A resin composition comprising:
a maleimide compound (A) having a transmittance of 5% or more at a wavelength of 405 nm (h-line);
at least one carboxylic acid containing compound (B) selected from a compound represented by the following formula (1), a compound represented by the following formula (2), a compound represented by the following formula (3), and a compound represented by the following formula (4); and
a photo initiator (C) comprising a compound represented by the following formula (8):

wherein each R 5 independently represents a substituent represented by the following formula (9) or a phenyl group:

wherein -* represents a bonding hand and each R 6 independently represents a hydrogen atom or a methyl group;

wherein each R 1 independently represents a hydrogen atom, a hydroxyl group, a carboxy group, an amino group, or an aminomethyl group; each k 1 independently represents an integer of 1 to 5; and when the formula (1) has two or more carboxy groups, the formula (1) may be an acid anhydride formed by linking the two or more carboxy groups to each other,

wherein each R 2 independently represents a hydrogen atom, a hydroxyl group, a carboxy group, a carboxymethyl group, an amino group, or an aminomethyl group; each l 1 independently represents an integer of 1 to 9; when the formula (2) has two or more carboxy groups, the formula (2) may be an acid anhydride formed by linking the two or more carboxy groups to each other; and when the formula (2) has a carboxymethyl group, the formula (2) may be an acid anhydride formed by linking a carboxymethyl group and a carboxy group to each other,

wherein each R 3 independently represents a hydrogen atom, a hydroxyl group, a carboxy group, a carboxymethyl group, an amino group, or an aminomethyl group; each m 1 independently represents an integer of 1 to 9; when the formula (3) has two or more carboxy groups, the formula (3) may be an acid anhydride formed by linking the two or more carboxy groups to each other; and when the formula (3) has a carboxymethyl group, the formula (3) may be an acid anhydride formed by linking a carboxymethyl group and a carboxy group to each other, and

wherein each R 4 independently represents a hydrogen atom, a hydroxyl group, a carboxy group, a carboxymethyl group, an amino group, or an aminomethyl group; each j 1 independently represents an integer of 1 to 5; when the formula (4) has one or more carboxy groups, the formula (4) may be an acid anhydride formed by linking a carboxymethyl group and a carboxy group to each other; when the formula (4) has two or more carboxy groups, the formula (4) may be an acid anhydride formed by linking the two or more carboxy groups to each other; and when the formula (4) has two or more carboxymethyl groups, the formula (4) may be an acid anhydride formed by linking the two or more carboxymethyl groups to each other,
wherein the resin composition is light-sensitive and photocurable when exposed with an active energy ray including a wavelength of 405 nm (h-line), and has alkaline developability.

2. The resin composition according to claim 1 , wherein the carboxylic acid containing compound (B) is contained at 0.01 to 60 parts by mass based on 100 parts by mass of the maleimide compound (A).

3. The resin composition according to claim 1 , wherein the carboxylic acid containing compound is at least one selected from a compound represented by the following formula (5), a compound represented by the following formula (6), and a compound represented by the following formula (7):

wherein each R 1 independently represents a hydrogen atom, a hydroxyl group, an amino group, or an aminomethyl group; each k 2 independently represents an integer of 0 to 4; o represents an integer of (5-k 2 ); and the formula (5) may be an acid anhydride formed by linking two or more carboxy groups to each other,

wherein each R 3 independently represents a hydrogen atom, a hydroxyl group, a carboxymethyl group, an amino group, or an aminomethyl group; each m 2 independently represents an integer of 0 to 8; p represents an integer of (9-m 2 ); the formula (6) may be an acid anhydride formed by linking carboxy groups to each other; and when the formula (6) has a carboxymethyl group, the formula (6) may be an acid anhydride formed by linking a carboxymethyl group and a carboxy group to each other, and

wherein each R 4 independently represents a hydrogen atom, a hydroxyl group, a carboxymethyl group, an amino group, or an aminomethyl group; each j 2 independently represents an integer of 0 to 4; q represents an integer of (5-j 2 ); the formula (7) may be an acid anhydride formed by linking a carboxymethyl group and a carboxy group to each other; when the formula (7) has two or more carboxy groups, the formula (7) may be an acid anhydride formed by linking the two or more carboxy groups to each other; and when the formula (7) has two or more carboxymethyl groups, the formula (7) may be an acid anhydride formed by linking the two or more carboxymethyl groups to each other.

4. The resin composition according to claim 1 , wherein the maleimide compound (A) comprises a bismaleimide compound.

5. A resin sheet comprising:
a support; and
a resin layer disposed on one surface or both surfaces of the support,
wherein the resin layer comprises the resin composition according to claim 1 .

6. The resin sheet according to claim 5 , wherein the resin layer has a thickness of 1 to 50 μm.

7. A multilayer printed wiring board comprising:
an insulation layer; and
a conductor layer formed on one surface or both surfaces of the insulation layer,
wherein the insulation layer comprises the resin composition according to claim 1 .

8. A semiconductor device comprising the resin composition according to claim 1 .

Assignees

• Mitsubishi Gas Chemical Co

Inventors

• Kumazawa Yune
• Suzuki Takuya
• Shika Seiji

Classifications

• H05K2201/0358

  Resin coated copper [RCC] · CPC title

• H05K2201/0154

  Polyimide · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K1/0366

  reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence) · CPC title

• C08J2379/08

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title