Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, and method for forming pattern
US-2020166844-A1 · May 28, 2020 · US
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US11680139B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11680139-B2 |
| Application number | US-202017621906-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 26, 2020 |
| Priority date | Jun 28, 2019 |
| Publication date | Jun 20, 2023 |
| Grant date | Jun 20, 2023 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A resin composition of the present invention is a resin composition containing a bismaleimide compound (A) containing a constituent unit represented by the following formula (1), and maleimide groups at both ends of the molecular chain, at least one resin or compound (B) selected from the group consisting of a maleimide compound other than the bismaleimide compound (A), a cyanate compound, a benzoxazine compound, an epoxy resin, a carbodiimide compound, and a compound having an ethylenically unsaturated group, and a photo initiator (C):wherein R1 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; R2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; each R3 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms; and each n independently represents an integer of 1 to 10.
First claim
Opening claim text (preview).
The invention claimed is: 1. A multilayer printed wiring board comprising: an insulating layer; and a conductor layer formed on one surface or both surfaces of the insulating layer, wherein the insulating layer comprises a resin composition comprising a bismaleimide compound (A) comprising a constituent unit represented by the following formula (1), and maleimide groups at both ends of the molecular chain; at least one resin or compound (B) selected from the group consisting of a cyanate compound, a benzoxazine compound, an epoxy resin, a carbodiimide compound, and a compound having two or more ethylenically unsaturated groups in a molecule; and a photo initiator (C): wherein R 1 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; R 2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; each R 3 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms; and each n independently represents an integer of 1 to 10. 2. The multilayer printed wiring board of claim 1 , wherein the photo initiator (C) comprises a compound represented by the following formula (2): wherein each R 4 independently represents a substituent represented by the following formula (3) or a phenyl group; and wherein -* represents a bonding hand, and each R 5 independently represents a hydrogen atom or a methyl group.
Assignees
Inventors
Classifications
containing a filler · CPC title
comprising organic materials, e.g. plastics or resins · CPC title
containing additives, e.g. fillers (H05K1/036 takes precedence) · CPC title
- C08G73/1025Primary
polymerised by radiations · CPC title
Five-membered rings · CPC title
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Frequently asked questions
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- What does patent US11680139B2 cover?
- A resin composition of the present invention is a resin composition containing a bismaleimide compound (A) containing a constituent unit represented by the following formula (1), and maleimide groups at both ends of the molecular chain, at least one resin or compound (B) selected from the group consisting of a maleimide compound other than the bismaleimide compound (A), a cyanate compound, a be…
- Who is the assignee on this patent?
- Mitsubishi Gas Chemical Co
- What technology area does this patent fall under?
- Primary CPC classification C08G73/1025. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jun 20 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).