Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board

Patent metadata

Field	Value
Publication number	US-10257938-B2
Application number	US-201414907486-A
Country	US
Kind code	B2
Filing date	Jul 24, 2014
Priority date	Jul 24, 2013
Publication date	Apr 9, 2019
Grant date	Apr 9, 2019

Abstract

The present invention provides a surface-treated copper foil capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The present invention also provides a resin substrate provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil of the present invention is a surface-treated copper foil, wherein a surface-treated layer is formed on a copper foil, and the proportion of the area corresponding to the particles of the surface of the surface-treated layer is 0.1 to 0.85.

First claim

The invention claimed is:

1. A surface-treated copper foil, wherein a surface-treated layer is formed on a copper foil, satisfying at least one of the following (A) to (I):
(A) the number density of the particles on the surface of the surface-treated layer is 3.8 to 430 particles/μm 2 , and the proportion of the area corresponding to the particles of the surface of the surface-treated layer is 0.1 to 0.85,
(B) the average diameter of the particles on the surface of the surface-treated layer is 0.03 to 0.28 μm, and the number density of the particles on the surface of the surface-treated layer is 3.8 to 430 particles/μm 2 ,
(C) the number density of the particles on the surface of the surface-treated layer is 3.8 to 430 particles/μm 2 ,
(D) when a surface-treated copper foil is bonded, via the surface-treated layer side of the surface-treated copper foil, to a resin substrate and the surface-treated copper foil is removed, the average length of white portions on the surface, on the copper foil removal side, of the resin substrate is 0.07 to 0.23 μm,
(E) when a surface-treated copper foil is bonded, via the surface-treated layer side of the surface-treated copper foil, to a resin substrate and the surface-treated copper foil is removed, the maximum length of the white portions on the surface, on the copper foil removal side, of the resin substrate is 0.704 to 0.88 μm,
(F) when a surface-treated copper foil is bonded, via the surface-treated layer side of the surface-treated copper foil, to a resin substrate and the surface-treated copper foil is removed, the average length of the largest 10 white portions on the surface, on the copper foil removal side, of the resin substrate is 0.15 to 0.457 μm,
(G) when a surface-treated copper foil is bonded, via the surface-treated layer side of the surface-treated copper foil, to a resin substrate and the surface-treated copper foil is removed, the average length of black portions on the surface, on the copper foil removal side, of the resin substrate is 0.035 to 0.20 μm,
(H) when a surface-treated copper foil is bonded, via the surface-treated layer side of the surface-treated copper foil, to a resin substrate and the surface-treated copper foil is removed, the maximum length of the black portions on the surface, on the copper foil removal side, of the resin substrate is 0.180 to 0.605 μm, and the number density of the particles on the surface of the surface-treated layer is 3.8 to 430 particles/μm 2 , or
(I) when a surface-treated copper foil is bonded, via the surface-treated layer side of the surface-treated copper foil, to a resin substrate and the surface-treated copper foil is removed, the average length of the largest 10 black portions on the surface, on the copper foil removal side, of the resin substrate is 0.06 to 0.335 μm.

2. A copper foil with carrier, comprising on one side or both sides of the carrier, an intermediate layer and an ultra-thin copper layer in this order, wherein the ultra-thin copper layer is the surface-treated copper foil according to claim 1 , and optionally the surface-treated copper foil comprising a resin layer on the surface-treated layer.

3. A substrate prepared by bonding the surface-treated copper foil according to claim 1 , via the surface-treated layer side of the surface-treated copper foil, to a substrate, and by removing the surface-treated copper foil, or
a substrate prepared by bonding a copper foil with carrier, comprising a carrier, an intermediate layer and an ultra-thin copper layer in this order, wherein the ultra-thin copper layer is the surface-treated copper foil according to claim 1 , via the ultra-thin copper layer side of the copper foil with carrier, to a substrate, and by removing the copper foil with carrier, and satisfying at least one of the following (1) to (7):
(1) the average length of the white portions on the surface, on the copper foil removal side, is 0.07 to 0.23 μm,
(2) the maximum length of the white portions on the surface, on the copper foil removal side, is 0.704 to 0.88 μm,
(3) the average length of the largest 10 white portions on the surface, on the copper foil removal side, is 0.15 to 0.457 μm,
(4) the average length of the black portions on the surface, on the copper foil removal side, is 0.035 or more and less than 0.20 μm,
(5) the maximum length of the black portions on the surface, on the copper foil removal side, is 0.180 to 0.605 μm,
(6) the average length of the largest 10 black portions on the surface, on the copper foil removal side, is 0.06 to 0.335 μm, or
(7) the proportion of the white portions on the surface, on the copper foil removal side, of the substrate is 55 to 68%.

4. The surface-treated copper foil according to claim 1 , satisfying at least one of the following (1) to (4):
(1) the surface-treated layer is a roughening-treated layer,
(2) the surface-treated layer is a roughening-treated layer, and the surface-treated copper foil comprises, on the surface of the roughening-treated layer, one or more layers selected from the group consisting of a heat resistant layer, a rust-preventing layer, a chromate-treated layer and a silane coupling treated layer,
(3) the surface-treated layer is one or more layers selected from the group consisting of a roughening-treated layer, a heat resistant layer, a rust-preventing layer, a chromate-treated layer and a silane coupling treated layer, or
(4) the surface-treated layer is provided with a resin layer on the surface-treated layer.

5. A method for producing a printed wiring board, comprising:
a step of preparing the surface-treated copper foil according to claim 1 or a copper foil with carrier comprising a carrier, an intermediate layer and an ultra-thin copper layer in this order, wherein the ultra-thin copper layer is the surface-treated copper foil according to claim 1 , and an insulating substrate or a resin layer formed with a metal foil or a copper foil with carrier;
a step of laminating the surface-treated copper foil, via the surface-treated layer side of the surface-treated copper foil, on the insulating substrate or the resin layer, or a step of laminating the copper foil with carrier, via the ultra-thin copper layer side of the surface-treated copper foil, on the insulating substrate or the resin layer, and then, peeling the carrier of the copper foil with carrier;
a step of removing the surface-treated copper foil on the insulating substrate or the resin layer, or a step of removing the ultra-thin copper layer on the insulating substrate or the resin layer after the peeling of the carrier; and
a step of forming a circuit on the surface of the insulating substrate or the resin layer with the surface-treated copper foil or the ultra-thin copper layer removed therefrom.

6. A method for producing a printed wiring board, comprising:
a step of preparing the surface-treated copper foil according to claim 1 , or a copper foil with carrier, comprising a carrier, an intermediate layer and an ultra-thin copper layer in this order, wherein the ultra-thin copper layer is the surface-treated copper foil according to claim 1 , and an insulating substrate;
a step of forming a copper clad laminate by laminating the surface-treated copper foil, via the surface-treated layer side of the surface-treated copper foil, on the insulating substrate, or a step of forming a copper clad laminate by laminating the copper foil with carrier, via the ultra-thin copper layer side of the surface-treated copper foil, on the insulating substrate, and then, peeling the carrier of the copper foil with carrier; and
a step of subsequently forming a circuit by a semi-additive method, a subtractive method, a partly additive method or a modified semi-additive method.

7. A method for producing a printed wirin

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Kohiki Michiya

Classifications

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• C25D5/10

  Electroplating with more than one layer of the same or of different metals (for bearings C25D7/10) · CPC title

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title

• H05K2201/0355

  Metal foils · CPC title

• C25D1/04

  Wires; Strips; Foils · CPC title