Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board

Patent metadata

Field	Value
Publication number	US-10187983-B2
Application number	US-201614996768-A
Country	US
Kind code	B2
Filing date	Jan 15, 2016
Priority date	Jan 16, 2015
Publication date	Jan 22, 2019
Grant date	Jan 22, 2019

Abstract

Provided is a copper foil provided with a carrier which enables to form an extremely fine circuit and to suppress the disconnection of a circuit well. A copper foil provided with a carrier having, in order, an intermediate layer and an ultrathin copper layer on one side or both sides of the carrier, wherein the ultrathin copper layer is an electrolytic copper layer; and the thickness of the ultrathin copper layer measured by using a gravimetric method is 1.5 μm or less and the number of pinholes in the ultrathin copper layer is 0 pinholes/m 2 or more and 5 pinholes/m 2 or less.

First claim

The invention claimed is:

1. A copper foil provided with a carrier comprising, in order, an intermediate layer and an ultrathin copper layer on one side or both sides of the carrier, wherein
the ultrathin copper layer is an electrolytic copper layer; and
a thickness of the ultrathin copper layer measured by using a gravimetric method is 1.5 μm or less and a number of pinholes in the ultrathin copper layer is 0 pinholes/m 2 or more and 5 pinholes/m 2 or less.

2. The copper foil provided with a carrier according to claim 1 , wherein a thickness of the ultrathin copper layer measured by using the gravimetric method is 0.15 to 0.85 μm.

3. The copper foil provided with a carrier according to claim 1 , wherein the ultrathin copper layer has a gloss copper plating layer.

4. The copper provided with a carrier according to claim 1 comprising:
one or more layers selected from the group consisting of a roughened layer, a heat resistant layer, an anti-corrosion layer, a chromate-treated layer and a silane coupling-treated layer.

5. The copper foil provided with a carrier according to claim 4 comprising a resin layer provided above one or more layers selected from the group consisting of the roughened layer, the heat resistant layer, an anti-corrosion layer, a chromate-treated layer and a silane coupling-treated layer.

6. The copper foil provided with a carrier according to claim 4 , wherein the roughened layer is a layer consisting of a simple substance or one or more said simple substances, the simple substance being selected from the group consisting of copper, nickel, cobalt, phosphorous, tungsten, arsenic, molybdenum, chromium and zinc.

7. The copper foil provided with a carrier according to claim 1 comprising a resin layer provided above the ultrathin copper layer.

8. A laminate fabricated by using the copper foil provided with a carrier according to claim 1 .

9. A method for fabricating a printed wiring board comprising:
a step of providing a resin layer and a circuit at least one time on one side or both sides of the laminate according to claim 8 ; and
a step of, after the resin layer and the circuit have been formed, peeling the carrier or the ultrathin copper layer from the copper foil provided with a carrier constituting the laminate.

10. A printed wiring board comprising the copper foil provided with a carrier according to claim 1 .

11. An electronic device comprising the printed wiring board according to claim 10 .

12. A method for fabricating a printed wiring board comprising:
forming a copper-clad laminate by carrying out
a step of preparing a copper foil provided with the carrier according to claim 1 and an insulating substrate,
a step of laminating the copper foil provided with the carrier and the insulating substrate, and
a step of, after the copper foil provided with the carrier and the insulating substrate have been laminated, peeling the carrier of the copper foil provided with the carrier; and
then forming a circuit by any of a semi-additive method, a subtractive method, a partly additive method, and a modified semi-additive method.

13. A method for fabricating a printed wiring board comprising:
a step of forming a circuit on the ultrathin copper layer side surface or the carrier side surface of a copper foil provided with the carrier according to claim 1 ;
a step of forming a resin layer on the ultrathin copper layer side surface or the carrier side surface of the copper foil provided with the carrier so that the circuit is buried;
a step of forming a circuit on the resin layer;
a step of peeling the carrier or the ultrathin copper layer after forming the circuit on the resin layer; and
a step of exposing the circuit buried in the resin layer that is formed on the ultrathin copper layer side surface or the carrier side surface by, after the carrier or the ultrathin copper layer has been peeled off, removing the ultrathin copper layer or the carrier.

14. A method for fabricating a printed wiring board comprising:
a step of laminating the ultrathin copper layer side surface and/or the carrier side surface of a copper foil provided with the carrier according to claim 1 and a resin substrate;
a step of providing a resin layer and a circuit at least one time on the ultrathin copper layer side surface and/or the carrier side surface of the copper foil provided with the carrier opposite to a side with the resin substrate laminated thereon; and
a step of, after the resin layer and the circuit have been formed, peeling the carrier or the ultrathin copper layer from the copper foil provided with the carrier.

15. A copper foil provided with a carrier comprising, in order, an intermediate layer and an ultrathin copper layer on one side or both sides of the carrier, wherein
the ultrathin copper layer is an electrolytic copper layer; and
a thickness of the ultrathin copper layer measured by using a gravimetric method is less than 1.0 μm and a number of pinholes in the ultrathin copper layer is 0 pinholes/m 2 or more and 10 pinholes/m 2 or less.

16. The copper foil provided with a carrier according to claim 15 , wherein a thickness of the ultrathin copper layer measured by using the gravimetric method is 0.15 to 0.85 μm.

17. The copper foil provided with a carrier according to claim 16 ,
wherein a surface roughness Rt of the carrier on the side to be provided with the ultrathin copper layer is 1.5 μm or less, and
the surface roughness Rt is measured using a non-contact roughness meter in accordance with JIS B0601-2001.

18. The copper foil provided with a carrier according to claim 17 , wherein the ultrathin copper layer has a gloss copper plating layer.

19. The copper foil provided with a carrier according to claim 15 , wherein a number of pinholes in the ultrathin copper layer is 0 pinholes/m 2 or more and 5 pinholes/m 2 or less.

20. The copper foil provided with a carrier according to claim 15 , wherein the ultrathin copper layer has a gloss copper plating layer.

21. The copper foil provided with a carrier according to claim 15 comprising:
one or more layers selected from the group consisting of a roughened layer, a heat resistant layer, an anti-corrosion layer, a chromate-treated layer and a silane coupling-treated layer.

22. The copper foil provided with a carrier according to claim 21 comprising a resin layer provided above one or more layers selected from the group consisting of the roughened layer, the heat resistant layer, an anti-corrosion layer, a chromate-treated layer and a silane coupling-treated layer.

23. A copper foil provided with a carrier comprising, in order, an intermediate layer and an ultrathin copper layer on one side or both sides of the carrier, wherein the ultrathin copper layer is an electrolytic copper layer; and
a thickness of the ultrathin copper layer measured by using a gravimetric method is 0.85 μm or less and a number of pinholes in the ultrathin copper layer is in a range of 0 pinholes/m 2 to 5 pinholes/m 2 .

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Kohiki Michiya
• Nagaura Tomota

Classifications

• H05K3/4007

  Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465) · CPC title

• H05K3/108

  by semi-additive methods; masks therefor (characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241) · CPC title

• H05K3/025

  by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper · CPC title

• H05K3/421

  Blind plated via connections (H05K3/422, H05K3/423 and H05K3/425 take precedence) · CPC title

• H05K2203/0307

  Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites · CPC title