Method of manufacturing a semiconductor device having frame structures laterally surrounding backside metal structures
US-11990520-B2 · May 21, 2024 · US
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Knabl Michael patents
Knabl Michael is listed as an inventor on 14 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Knabl Michael |
| Total patents | 14 |
| First publication | Apr 19, 2016 |
| Latest publication | May 21, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Method of processing a semiconductor wafer, semiconductor wafer, and semiconductor die produced from a semiconductor wafer
US-11610817-B2 · Mar 21, 2023 · US
Method for processing a semiconductor wafer, semiconductor composite structure and support structure for semiconductor wafer
US-11515264-B2 · Nov 29, 2022 · US
Method for Processing a Semiconductor Wafer and Semiconductor Composite Structure
US-2022359428-A1 · Nov 10, 2022 · US
Method of processing a semiconductor wafer, semiconductor wafer, and semiconductor die produced from a semiconductor wafer
US-2022301933-A1 · Sep 22, 2022 · US
Method of manufacturing a semiconductor device having frame structures laterally surrounding backside metal structures
US-2022085174-A1 · Mar 17, 2022 · US
Semiconductor device and method of manufacturing a semiconductor device
US-11211459-B2 · Dec 28, 2021 · US
Semiconductor Device and Method of Manufacturing a Semiconductor Device
US-2020194558-A1 · Jun 18, 2020 · US
Method for manufacturing semiconductor devices
US-10580753-B2 · Mar 3, 2020 · US
Method for Processing a Semiconductor Wafer, Semiconductor Composite Structure and Support Structure for Semiconductor Wafer
US-2019363057-A1 · Nov 28, 2019 · US
Recent patents
Latest publications not already listed above.
Method for manufacturing semiconductor devices
US-2019027464-A1 · Jan 24, 2019 · US
Metal deposition on substrates
US-9698106-B2 · Jul 4, 2017 · US
Metal Deposition on Substrates
US-2016203979-A1 · Jul 14, 2016 · US
Metal deposition on substrates
US-9318446-B2 · Apr 19, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 9 |
| Infineon Technologies Austria Ag | 3 |
| Infineon Technologies Austria | 1 |
| Infineon Technologies Austria | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P54/00 | 6 |
| H10W46/00 | 6 |
| H10W46/301 | 6 |
| H10W46/503 | 6 |
| H01L21/78 | 6 |