Integrated chip and manufacturing method therefor, and full-color integrated chip and display panel
US-12183868-B2 · Dec 31, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W46/301 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 4,585 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 291 |
| 2016 | 275 |
| 2017 | 326 |
| 2018 | 352 |
| 2019 | 414 |
| 2020 | 447 |
| 2021 | 477 |
| 2022 | 458 |
| 2023 | 463 |
| 2024 | 510 |
| 2025 | 462 |
| 2026 | 110 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Substrate correction device, substrate lamination device, substrate processing system, substrate correction method, substrate processing method, and semiconductor device manufacturing method
US-2024404859-A1 · Dec 5, 2024 · US
Pickup apparatus and method of using the same
US-12142499-B2 · Nov 12, 2024 · US
Apparatus with circuit-locating mechanism
US-2024265990-A1 · Aug 8, 2024 · US
Method for manufacturing substrate with chips, and substrate processing device
US-2024079403-A1 · Mar 7, 2024 · US
Three-direction alignment mark
US-9217917-B2 · Dec 22, 2015 · US
Semiconductor device with covering member that partially covers wiring substrate
US-2015364392-A1 · Dec 17, 2015 · US
Electronic device, method of manufacturing the same, and camera
US-9202834-B2 · Dec 1, 2015 · US
Reticle mark arrangement method and nontransitory computer readable medium storing a reticle mark arrangement program
US-2015339423-A1 · Nov 26, 2015 · US
Bonding alignment tool
US-2015340337-A1 · Nov 26, 2015 · US
Method of chip positioning for multi-chip packaging
US-9196608-B2 · Nov 24, 2015 · US
Designing and manufacturing methods of tft lcd array positioning mark
US-2015333015-A1 · Nov 19, 2015 · US
Connection method, connection structure, insulating adhesive member, electronic component having adhesive member, and method for manufacturing same
US-9190381-B2 · Nov 17, 2015 · US
Method of manufacturing semiconductor device, and semiconductor device
US-2015325528-A1 · Nov 12, 2015 · US
Optical element with integrated indicator
US-2015325759-A1 · Nov 12, 2015 · US
Semiconductor devices and methods for fabricating the same
US-9184136-B2 · Nov 10, 2015 · US
Thin film transistor array substrate, method of manufacturing the same, and display device
US-9177920-B2 · Nov 3, 2015 · US
Method of die singulation using laser ablation and induction of internal defects with a laser
US-9165832-B1 · Oct 20, 2015 · US
Mark segmentation method and method for manufacturing a semiconductor structure applying the same
US-2015294058-A1 · Oct 15, 2015 · US
Semiconductor device with face-to-face chips on interposer and method of manufacturing the same
US-9147667-B2 · Sep 29, 2015 · US
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W46/301?
- CPC H10W46/301 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H10W46/301 (Electricity)?
- Our database includes 4,585 publications tagged with this CPC code.
- Is patent activity under CPC H10W46/301 growing?
- Publication counts under this code: 510 in 2024 vs 462 in 2025 (latest complete years).