Laser processing apparatus and laser processing method
US-12533751-B2 · Jan 27, 2026 · US
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Kirihara Naotoshi patents
Kirihara Naotoshi is listed as an inventor on 32 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kirihara Naotoshi |
| Total patents | 32 |
| First publication | Jul 30, 2015 |
| Latest publication | Jan 27, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Laser processing apparatus
US-2025326066-A1 · Oct 23, 2025 · US
Laser processing apparatus
US-12343812-B2 · Jul 1, 2025 · US
Laser processing apparatus and laser processing method
US-12337412-B2 · Jun 24, 2025 · US
Laser processing apparatus and laser processing method
US-2024227083-A9 · Jul 11, 2024 · US
Laser processing apparatus
US-2024139864-A1 · May 2, 2024 · US
Laser processing apparatus and laser processing method
US-2024139863-A1 · May 2, 2024 · US
Laser processing apparatus and laser processing method
US-2024131629-A1 · Apr 25, 2024 · US
Laser processing apparatus and laser processing method
US-2024123546-A1 · Apr 18, 2024 · US
Laser processing machine
US-2024082951-A1 · Mar 14, 2024 · US
Recent patents
Latest publications not already listed above.
Laser processing method
US-11833608-B2 · Dec 5, 2023 · US
Laser processing method
US-2022288719-A1 · Sep 15, 2022 · US
Laser processing apparatus
US-10692740-B2 · Jun 23, 2020 · US
Wafer processing apparatus
US-10658171-B2 · May 19, 2020 · US
Laser processing method for wafer
US-10573559-B2 · Feb 25, 2020 · US
Wafer processing apparatus
US-10388508-B2 · Aug 20, 2019 · US
Wafer processing apparatus
US-2019252179-A1 · Aug 15, 2019 · US
Method of processing workpiece with laser beam
US-2019217419-A1 · Jul 18, 2019 · US
Laser processing method for wafer
US-2019164833-A1 · May 30, 2019 · US
Method of processing wafer
US-10297710-B2 · May 21, 2019 · US
Method of processing wafer
US-2018309018-A1 · Oct 25, 2018 · US
Optical device wafer processing method
US-10109527-B2 · Oct 23, 2018 · US
Laser processing apparatus
US-2017330774-A1 · Nov 16, 2017 · US
Wafer processing apparatus
US-2017323774-A1 · Nov 9, 2017 · US
Laser beam spot shape detection method
US-9789567-B2 · Oct 17, 2017 · US
Processing method of optical device wafer
US-9761492-B2 · Sep 12, 2017 · US
Processing method of optical device wafer
US-2017103921-A1 · Apr 13, 2017 · US
Optical device wafer processing method
US-2017098579-A1 · Apr 6, 2017 · US
Wafer divider and wafer division method
US-9472459-B2 · Oct 18, 2016 · US
Wafer divider and wafer division method
US-2016247723-A1 · Aug 25, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Disco Corp | 32 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B23K26/0622 | 19 |
| H10P54/00 | 18 |
| B23K2101/40 | 17 |
| B23K26/38 | 15 |
| H01L21/78 | 15 |