Laser processing apparatus and laser processing method

Patent metadata

Field	Value
Publication number	US-12337412-B2
Application number	US-202318494242-A
Country	US
Kind code	B2
Filing date	Oct 25, 2023
Priority date	Oct 27, 2022
Publication date	Jun 24, 2025
Grant date	Jun 24, 2025

Abstract

A laser processing apparatus includes a laser oscillating mechanism for emitting pulsed laser beams. The laser oscillating mechanism includes a group setting section for establishing the number of pulsed laser beams to be applied to a workpiece until a time after which melted debris produced by the pulsed laser beams applied to the workpiece is solidified, and assigns the pulsed laser beams to a group, under conditions that, within a period of time which is shorter than a period of time in which the melted debris is produced, and within a period of time after which a plasma generated by the pulsed laser beam becomes extinct, a next pulsed laser beam is applied to the workpiece to sustain the plasma uninterruptedly to break growing debris, and a time interval setting section for establishing a time interval between the group and another group adjacent thereto.

First claim

What is claimed is:

1. A laser processing apparatus comprising:
a chuck table for holding a workpiece thereon;
a laser beam applying unit for applying pulsed laser beams to the workpiece held on the chuck table; and
a feed mechanism for processing-feeding the chuck table and the laser beam applying unit relative to each other,
wherein the laser beam applying unit includes a laser oscillating mechanism for emitting the pulsed laser beams and a beam condenser for converging the pulsed laser beams emitted from the laser oscillating mechanism and applying the converged pulsed laser beams to the workpiece held on the chuck table, and
the laser oscillating mechanism includes
a group setting section for establishing the number of the pulsed laser beams to be applied to the workpiece until a time after which melted debris produced by the pulsed laser beams applied to the workpiece is solidified, and assigns the pulsed laser beams to a group, under conditions that, within a period of time which is shorter than a period of time in which the melted debris is produced from the workpiece by a pulsed laser beam applied to the workpiece, and within a period of time after which a plasma generated from the workpiece by the pulsed laser beam applied thereto becomes extinct, a next pulsed laser beam is applied to the workpiece to sustain the plasma uninterruptedly to break growing debris, and
a time interval setting section for establishing a time interval between the group and another group adjacent thereto as representing a period of time taken for heat generated by the application of the pulsed laser beams of the group to be dissipated, and also establishing time intervals between the pulsed laser beams of the group,

the laser oscillating mechanism setting a repetitive frequency for each group of the pulsed laser beams as one unit.

2. The laser processing apparatus according to claim 1 ,
wherein the laser oscillating mechanism includes a plurality of laser diodes for emitting the pulsed laser beams,
the group setting section establishes the group of the pulsed laser beams to be emitted from the laser diodes, and
the time interval setting section controls a pulse delay generator to input signals to the laser diodes at desired time intervals, and also controls the pulse delay generator to input signals to the laser diodes to set the period of time taken for the heat generated in the workpiece by the application of the pulsed laser beams of the group thereto to be dissipated, as the time interval between the group and the other group adjacent thereto.

3. The laser processing apparatus according to claim 1 ,
wherein the laser oscillating mechanism includes a plurality of laser oscillators for emitting the pulsed laser beams,
the group setting section establishes the group of the pulsed laser beams to be emitted from the laser oscillators, and
the time interval setting section controls a delayed voltage generator to apply delayed voltages to the laser oscillators to cause the laser oscillators to emit the pulsed laser beams at desired time intervals, and also controls the delayed voltage generator to set the period of time taken for the heat generated in the workpiece by the application of the pulsed laser beams of the group thereto to be dissipated, as the time interval between the group and the other group adjacent thereto.

4. The laser processing apparatus according to claim 1 , wherein the laser oscillating mechanism sets the repetitive frequency by decimating a predetermined number of groups from among the groups of the pulsed laser beams emitted in a second.

5. A laser processing method of processing a workpiece by using a laser processing apparatus having a laser oscillating mechanism that includes a group setting section for establishing a group of pulsed laser beams and a time interval setting section for establishing time intervals between the pulsed laser beams of the group, the laser oscillating mechanism setting a repetitive frequency for each group of the pulsed laser beams as one unit, the laser processing method comprising:
a groove forming step of forming grooves in the workpiece by way of ablation by applying the pulsed laser beams to the workpiece; and
a debris breaking and restraining step of breaking growing debris produced in the groove forming step and restraining melted debris from being produced in the groove forming step,
wherein, in order to simultaneously carry out the debris breaking and restraining step when the groove forming step is carried out,
the group setting section establishes the number of the pulsed laser beams of the group to be applied to the workpiece until a time after which the melted debris produced by the pulsed laser beams applied to the workpiece is solidified, under conditions that, within a period of time which is shorter than a period of time in which the melted debris is produced from the workpiece by a pulsed laser beam applied to the workpiece, and within a period of time after which a plasma generated from the workpiece by the pulsed laser beam applied thereto becomes extinct, a next pulsed laser beam is applied to the workpiece to sustain the plasma uninterruptedly to break the growing debris, and
the interval setting section establishes a time interval between the group and another group adjacent thereto as representing a period of time taken for heat generated by the application of the pulsed laser beams of the group to be dissipated, and also establishing time intervals between the pulsed laser beams of the group.

6. The laser processing method according to claim 5 ,
Wherein, providing that the melted debris is produced after a period of time t1 and solidified after a period of time t2 after the pulsed laser beam has been applied to the workpiece,
the time interval setting section establishes time intervals t3 between the pulsed laser beams of the group so as to satisfy t3<t1 and also to satisfy t4<t3<t5 where t4 represents a period of time taken for the plasma to be generated from the workpiece and t5 represents a period of time taken for the plasma to become extinct, and
the group setting section establishes the number n of the pulsed laser beams of the group as an integral part of n=(t2/t3)+1.

Assignees

• Disco Corp

Inventors

• Kirihara Naotoshi
• Morikazu Hiroshi
• Kaneko Yohei
• Odanaka Kentaro

Classifications

• B23K26/36

  Removing material (B23K26/55, B23K26/57 take precedence) · CPC title

• B23K2103/56

  being semiconducting · CPC title

• B23K26/364 Primary

  for making a groove or trench, e.g. for scribing a break initiation groove · CPC title

• B23K26/0622 Primary

  by shaping pulses · CPC title

• B23K26/0624 Primary

  using ultrashort pulses, i.e. pulses of 1 ns or less · CPC title