Laser processing method

Patent metadata

Field	Value
Publication number	US-2022288719-A1
Application number	US-202217653564-A
Country	US
Kind code	A1
Filing date	Mar 4, 2022
Priority date	Mar 9, 2021
Publication date	Sep 15, 2022
Grant date	—

Abstract

There is provided a laser processing method for performing laser processing on a wafer having a functional layer on a substrate. The laser processing method includes a blackening step of emitting a pulsed laser beam of a wavelength transparent to the functional layer from a laser oscillator and blackening the functional layer by irradiating the functional layer with the pulsed laser beam of energy equal to or higher than a processing threshold value at which the functional layer is processed such that an overlap ratio of the pulsed laser beam successively applied to the functional layer is equal to or more than 90% and less than 100%, and a groove processing step of forming a laser-processed groove by irradiating the blackened functional layer with the pulsed laser beam and making the blackened functional layer absorb the pulsed laser beam, after performing the blackening step.

First claim

What is claimed is:

1 . A laser processing method for performing laser processing on a wafer having organic films on a substrate, the laser processing method comprising:
a blackening step of emitting a pulsed laser beam of a wavelength transparent to the organic films from a laser oscillator and blackening the organic films by irradiating the organic films with the pulsed laser beam of energy equal to or higher than a processing threshold value at which the organic films are processed such that an overlap ratio of the pulsed laser beam successively applied to the organic films is equal to or more than 90% and less than 100%; and a groove processing step of forming a laser-processed groove by irradiating the blackened organic films with the pulsed laser beam and making the blackened organic films absorb the pulsed laser beam, after performing the blackening step.

2 . The laser processing method according to claim 1 , wherein,
in the blackening step, base parts of a Gaussian distribution of the pulsed laser beam applied to the organic films are modified to a vertical distribution, so that the pulsed laser beam of energy lower than the processing threshold value is prevented from being transmitted through the organic films and applied to the substrate.

Assignees

• Disco Corp

Inventors

• Kirihara Naotoshi
• Kaneko Takamasa

Classifications

• B23K26/702

  Auxiliary equipment · CPC title

• C30B29/06

  Silicon · CPC title

• B23K26/364

  for making a groove or trench, e.g. for scribing a break initiation groove · CPC title

• B23K26/402

  involving non-metallic material, e.g. isolators · CPC title

• C30B33/04 Primary

  using electric or magnetic fields or particle radiation · CPC title