Method and apparatus for laser dicing of wafers
US-2015318210-A1 · Nov 5, 2015 · US
Laser processing machine
US2024082951A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2024082951-A1 |
| Application number | US-202318452756-A |
| Country | US |
| Kind code | A1 |
| Filing date | Aug 21, 2023 |
| Priority date | Sep 8, 2022 |
| Publication date | Mar 14, 2024 |
| Grant date | — |
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- Title
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Abstract
Official abstract text for this publication.
A laser beam irradiation unit of a laser processing machine includes a laser oscillation unit that emits an initial pulsed laser beam, and a condenser that condenses the initial pulsed laser beam emitted by the laser oscillation unit and focuses a pulsed irradiation laser beam on a wafer having a silicon substrate and held on a chuck table. The laser oscillation unit is configured to oscillate a pulsed laser of deep ultraviolet light at a pulse interval shorter than a thermal diffusion time in an SiO 2 film stacked on an upper surface of the silicon substrate, and to emit the initial pulsed laser beam.
First claim
Opening claim text (preview).
What is claimed is: 1 . A laser processing machine comprising: a chuck table that holds a wafer having a silicon substrate; a laser beam irradiation unit that applies a pulsed irradiation laser beam to the wafer held on the chuck table; and a feed mechanism that causes a relative processing feed of the chuck table and the laser beam irradiation unit, wherein the laser beam irradiation unit includes a laser oscillation unit that emits an initial pulsed laser beam, and a condenser that condenses the initial pulsed laser beam emitted by the laser oscillation unit and focuses a pulsed irradiation laser beam on the wafer held on the chuck table, and the laser oscillation unit is configured to oscillate a pulsed laser of deep ultraviolet light at a pulse interval shorter than a thermal diffusion time in an SiO 2 film stacked on an upper surface of the silicon substrate, and to emit the initial pulsed laser beam. 2 . The laser processing machine according to claim 1 , wherein the deep ultraviolet light is a laser beam having a wavelength of 266 nm or shorter, and the initial pulsed laser beam emitted by the laser oscillation unit has a pulse width of 200 fs, which corresponds to a smallest point of energy density, or shorter. 3 . The laser processing machine according to claim 1 , wherein the laser beam irradiation unit is configured such that, when the initial pulsed laser beam emitted by the laser oscillation unit is applied as the pulsed irradiation laser beam, the pulsed irradiation laser beam has a pulse interval shorter than 1.0 μs that is the thermal diffusion time in the SiO 2 film.
Assignees
Inventors
Classifications
Semiconductor devices · CPC title
Auxiliary equipment · CPC title
- B23K26/00Primary
Working by laser beam, e.g. welding, cutting or boring · CPC title
Apparatus for mechanical treatment or grinding or cutting · CPC title
- B23K26/0665Primary
by beam condensation on the workpiece, e.g. for focusing · CPC title
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- What does patent US2024082951A1 cover?
- A laser beam irradiation unit of a laser processing machine includes a laser oscillation unit that emits an initial pulsed laser beam, and a condenser that condenses the initial pulsed laser beam emitted by the laser oscillation unit and focuses a pulsed irradiation laser beam on a wafer having a silicon substrate and held on a chuck table. The laser oscillation unit is configured to oscillate …
- Who is the assignee on this patent?
- Disco Corp
- What technology area does this patent fall under?
- Primary CPC classification B23K26/00. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Thu Mar 14 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).