Processing method of optical device wafer
US-2017103921-A1 · Apr 13, 2017 · US
Method of processing wafer
US10297710B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10297710-B2 |
| Application number | US-201815962772-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 25, 2018 |
| Priority date | Apr 25, 2017 |
| Publication date | May 21, 2019 |
| Grant date | May 21, 2019 |
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Abstract
Official abstract text for this publication.
A method of processing a wafer includes applying a laser beam having a wavelength that is transmittable through a sapphire substrate to the wafer while positioning a focused spot of the beam within the wafer in regions corresponding to projected dicing lines through a reverse side of the wafer, thereby forming a plurality of shield tunnels made up of a plurality of pores and an amorphous body surrounding the pores, at predetermined spaced intervals in the wafer along the projected dicing lines. A laser beam having a wavelength that is transmittable through the sapphire substrate to the wafer is applied while positioning a focused spot of the laser beam within the wafer in the projected dicing lines through the reverse side of the wafer, thereby forming modified layers between adjacent shield tunnels. Exerting external forces to the wafer divides the wafer into a plurality of optical device chips.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of processing a wafer to divide the wafer into individual optical device chips, the wafer including a sapphire substrate with a light-emitting layer deposited on a face side thereof and demarcated by a grid of intersecting projected dicing lines into a plurality of areas with optical devices disposed individually therein, the method comprising: a shield tunnel forming step of applying a pulsed laser beam having a wavelength that is transmittable through the sapphire substrate to the wafer while positioning a focused spot of the pulsed laser beam within the wafer in regions corresponding to the projected dicing lines through a reverse side of the wafer, thereby forming a plurality shield tunnels each made up of a pore and an amorphous body surrounding the pore, at predetermined spaced intervals in the wafer along the projected dicing lines; a modified layer forming step of applying a pulsed laser beam having a wavelength that is transmittable through the sapphire substrate to the wafer while positioning a focused spot of the pulsed laser beam within the wafer in the projected dicing lines through the reverse side of the wafer, thereby forming modified layers between adjacent ones of the shield tunnels; and a dividing step of exerting external forces to the wafer to divide the wafer into a plurality of optical device chips.
Assignees
Inventors
Classifications
- H10P54/00Primary
Cutting or separating of wafers, substrates or parts of devices · CPC title
Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title
- H10P58/00Primary
Singulating wafers or substrates into multiple chips, i.e. dicing · CPC title
- B23K26/0006Primary
taking account of the properties of the material involved (B23K26/32, B23K26/40 take precedence) · CPC title
Electricity · mapped topic
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- What does patent US10297710B2 cover?
- A method of processing a wafer includes applying a laser beam having a wavelength that is transmittable through a sapphire substrate to the wafer while positioning a focused spot of the beam within the wafer in regions corresponding to projected dicing lines through a reverse side of the wafer, thereby forming a plurality of shield tunnels made up of a plurality of pores and an amorphous body s…
- Who is the assignee on this patent?
- Disco Corp
- What technology area does this patent fall under?
- Primary CPC classification H10P54/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue May 21 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).