Laser processing apparatus and laser processing method

Patent metadata

Field	Value
Publication number	US-12533751-B2
Application number	US-202318490136-A
Country	US
Kind code	B2
Filing date	Oct 19, 2023
Priority date	Oct 21, 2022
Publication date	Jan 27, 2026
Grant date	Jan 27, 2026

Abstract

A laser beam irradiating unit of a laser processing apparatus includes a laser oscillating mechanism. The laser oscillating mechanism includes a group setting unit configured to, on a condition that a pulsed laser beam is applied at shorter time intervals than a length of time that molten debris is generated, set the number of pulsed laser beams to be applied until a time that the molten debris is solidified and set the number of pulsed laser beams as one group. A time interval setting unit is configured to set a time until heat generated by application of the pulsed laser beams of the one group is cooled, which serves as a time interval between the one group and an adjacent group, and set time intervals of the pulsed laser beams constituting the one group. The laser oscillating mechanism sets a repetition frequency with the one group as one unit.

First claim

What is claimed is:

1 . A laser processing method for processing a workpiece by using a laser processing apparatus, the laser processing apparatus including a laser oscillating mechanism, the laser oscillating mechanism including a group setting unit configured to set a plurality of pulsed laser beams as one group and a time interval setting unit configured to set time intervals of the pulsed laser beams constituting the one group, the laser oscillating mechanism being configured to set a repetition frequency with the one group as one unit, the laser processing method comprising:
a groove forming step of forming a groove through ablation processing by irradiating the workpiece with the pulsed laser beams; and a molten debris suppressing step of suppressing generation of molten debris in the groove forming step, in order to perform the molten debris suppressing step simultaneously at a time of the groove forming step, such that, during the molten debris suppressing step: the group setting unit sets a number n of the pulsed laser beams of the one group to be applied until a time that the molten debris is solidified, on a condition that the pulsed laser beams are applied at shorter time intervals than a length of time that the molten debris is generated by irradiation of the workpiece with the pulsed laser beams, and the time interval setting unit sets a time until heat generated by application of the pulsed laser beams of the one group is cooled serves as a time interval between the one group and an adjacent group and setting the time intervals of the pulsed laser beams constituting the one group, wherein: when the molten debris is generated at time t1 after irradiation of the workpiece with a first pulsed laser beam and the molten debris is solidified at time t2, the time interval setting unit sets the time intervals t3 of the pulsed laser beams of the one group such that t3 has a particular value which is greater than zero and less than t1, and the group setting unit sets the number n of the pulsed laser beams of the one group, such that the number n is calculated with the following formula: n=Integer Part of (t2/t3)+1.

2 . The laser processing method according to claim 1 , wherein, t1 is set to be 100 ns, and t2 is set to 500 ns.

3 . The laser processing method according to claim 2 , wherein, t3 is set to 60 ns, and n=9.

4 . The laser processing method according to claim 2 , wherein, t3 is set to 50 ns, and n=11.

5 . The laser processing method according to claim 1 , wherein, the time interval between the one group and an adjacent group is generated by a thinning-out unit which thins out a predetermined number of the groups, wherein the thinning-out unit is constituted by an acousto-optic element or an electro-optic element.

Assignees

• Disco Corp

Inventors

• Kirihara Naotoshi
• Morikazu Hiroshi
• Kaneko Yohei
• Odanaka Kentaro

Classifications

• H01L21/268

  Electricity · mapped topic

• B23K26/364 Primary

  for making a groove or trench, e.g. for scribing a break initiation groove · CPC title

• B23K26/40 Primary

  taking account of the properties of the material involved · CPC title

• H10P34/42

  with electromagnetic radiation, e.g. laser annealing (laser cutting H10P54/20) · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title