Pulsing rf coils of a plasma chamber in reverse synchronization
US-2026074147-A1 · Mar 12, 2026 · US
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Kamp Tom A patents
Kamp Tom A is listed as an inventor on 29 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kamp Tom A |
| Total patents | 29 |
| First publication | Jun 23, 2016 |
| Latest publication | Mar 12, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Pulsing RF coils of a plasma chamber in reverse synchronization
US-12494345-B2 · Dec 9, 2025 · US
System, method, and user interface for edge ring wear compensation
US-2025191962-A1 · Jun 12, 2025 · US
System, method, and user interface for edge ring wear compensation
US-12237203-B2 · Feb 25, 2025 · US
Vacuum pump protection against deposition byproduct buildup
US-12087561-B2 · Sep 10, 2024 · US
Vacuum pump protection against deposition byproduct buildup
US-2023317437-A1 · Oct 5, 2023 · US
Pulsing rf coils of a plasma chamber in reverse synchronization
US-2023282448-A1 · Sep 7, 2023 · US
Vacuum pump protection against deposition byproduct buildup
US-11710623-B2 · Jul 25, 2023 · US
Control of pulsing frequencies and duty cycles of parameters of rf signals
US-2023223236-A1 · Jul 13, 2023 · US
Evaporative cooling of electrostatic chucks
US-2023178344-A1 · Jun 8, 2023 · US
Recent patents
Latest publications not already listed above.
System, method, and user interface for edge ring wear compensation
US-2023083737-A1 · Mar 16, 2023 · US
System and method for edge ring wear compensation
US-11538713-B2 · Dec 27, 2022 · US
Moveable edge rings with reduced capacitance variation for substrate processing systems
US-2022270863-A1 · Aug 25, 2022 · US
Moveable edge rings with reduced capacitance variation for substrate processing systems
US-2022254612-A1 · Aug 11, 2022 · US
Integrated atomic layer passivation in tcp etch chamber and in-situ etch-alp method
US-2021287909-A1 · Sep 16, 2021 · US
Vacuum pump protection against deposition byproduct buildup
US-2021257195-A1 · Aug 19, 2021 · US
Vacuum pump protection against deposition byproduct buildup
US-11031215-B2 · Jun 8, 2021 · US
Integrated atomic layer passivation in TCP etch chamber and in-situ etch-ALP method
US-10950454-B2 · Mar 16, 2021 · US
System and method for edge ring wear compensation
US-2020373193-A1 · Nov 26, 2020 · US
Vacuum pump protection against deposition byproduct buildup
US-2020105509-A1 · Apr 2, 2020 · US
Silicon-based deposition for semiconductor processing
US-10600648-B2 · Mar 24, 2020 · US
Method for transferring a pattern from an organic mask
US-2019378725-A1 · Dec 12, 2019 · US
Integrated atomic layer passivation in tcp etch chamber and in-situ etch-alp method
US-2019043728-A1 · Feb 7, 2019 · US
Extreme edge sheath and wafer profile tuning through edge-localized ion trajectory control and plasma operation
US-10163610-B2 · Dec 25, 2018 · US
Silicon-based deposition for semiconductor processing
US-2018308693-A1 · Oct 25, 2018 · US
Shadow trim line edge roughness reduction
US-9711359-B2 · Jul 18, 2017 · US
Shadow trim line edge roughness reduction
US-2017047224-A1 · Feb 16, 2017 · US
Extreme edge sheath and wafer profile tuning through edge-localized ion trajectory control and plasma operation
US-2017018411-A1 · Jan 19, 2017 · US
Silicon etch and clean
US-2016181111-A1 · Jun 23, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 29 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P50/283 | 14 |
| H01J2237/334 | 14 |
| H01L21/67069 | 12 |
| H10P14/69215 | 11 |
| H01J37/3211 | 11 |