Silicon etch and clean

Patent metadata

Field	Value
Publication number	US-2016181111-A1
Application number	US-201414576978-A
Country	US
Kind code	A1
Filing date	Dec 19, 2014
Priority date	Dec 19, 2014
Publication date	Jun 23, 2016
Grant date	—

Abstract

A method for etching features into a silicon containing etch layer is provided. The etch layer is placed into a plasma processing chamber. An etch gas is flowed into the plasma processing chamber. The etch gas is formed into an etch plasma, wherein the etch plasma etches features into the silicon containing layer leaving silicon containing residue. The flow of etch gas into the plasma processing chamber is stopped. A dry clean gas is flowed into the plasma processing chamber, wherein the dry clean gas comprises NH 3 and NF 3 . The dry clean gas is formed into a plasma, wherein the silicon containing residue is exposed to the dry clean gas plasma, and wherein at least some or all of the silicon containing residue is formed into ammonium containing compounds. The flow of the dry clean gas is stopped. The ammonium compounds are sublimated from the films.

First claim

1 . A method for etching features into a silicon containing etch layer, comprising
placing the etch layer into a plasma processing chamber; flowing an etch gas into the plasma processing chamber; forming the etch gas into an etch plasma, wherein the silicon containing etch layer is exposed to the etch plasma, and wherein the etch plasma etches features into the silicon containing layer leaving silicon containing residue; stopping the flow of etch gas into the plasma processing chamber; flowing a dry clean gas into the plasma processing chamber, wherein the dry clean gas comprises NH 3 and NF 3 ; forming the dry clean gas into a non-remote plasma, wherein the silicon containing residue is exposed to the dry clean gas non-remote plasma, and wherein at least some of the silicon containing residue is formed into ammonium containing compounds; stopping the flow of the dry clean gas; and removing the etch layer from the plasma processing chamber.

2 . The method, as recited in claim 1 , wherein the dry clean gas further comprises a noble gas.

3 . The method, as recited in claim 2 , further comprising sublimating the ammonium containing compounds before removing the layer from the plasma processing chamber.

4 . The method, as recited in claim 3 , wherein the dry clean gas has a ratio of the flow of NH 3 to NF 3 of between 1:1 to 20:1.

5 . The method, as recited in claim 4 , during the forming the dry clean gas into a plasma a bias of between 0 to 1000 volts is provided.

6 . The method, as recited in claim 5 , wherein during the sublimating the ammonium containing compounds the etch layer is maintained at a temperature between 60° to 220° C.

7 . The method, as recited in claim 6 , wherein the etch layer is a silicon substrate, silicon wafer, a gate, a shallow trench isolation layer, a source layer, a drain layer, or a polysilicon layer.

8 . The method, as recited in claim 7 , wherein the etch gas is a halogen containing etch gas.

9 . The method, as recited in claim 1 , further comprising sublimating the ammonium containing compounds before removing the layer from the plasma processing chamber.

10 . The method, as recited in claim 9 , wherein during the sublimating the ammonium containing compounds the etch layer is maintained at a temperature between 60° to 220° C.

11 . The method, as recited in claim 1 , wherein the dry clean gas has a ratio of the flow of NH 3 to NF 3 of between 1:1 to 20:1.

12 . The method, as recited in claim 1 , during the forming the dry clean gas into a plasma a bias of between 0 to 1000 volts is provided.

13 . A method for etching a silicon substrate, silicon wafer, a source layer, a drain layer, or a polysilicon layer, comprising
placing the silicon substrate, silicon wafer, the source layer, the drain layer, or the polysilicon layer into a plasma processing chamber; flowing an etch gas into the plasma processing chamber; forming the etch gas into an etch plasma, wherein the silicon substrate, silicon wafer, the source layer, the drain layer, or the polysilicon layer is exposed to the etch plasma, and wherein the etch plasma etches features into the silicon substrate, silicon wafer, the source layer, the drain layer, or the polysilicon layer leaving silicon containing residue; stopping the flow of etch gas into the plasma processing chamber; flowing a dry clean gas into the plasma processing chamber, wherein the dry clean gas comprises NH 3 and NF 3 ; forming the dry clean gas into a plasma, wherein the silicon containing residue is exposed to the dry clean gas plasma, and wherein at least some of the silicon containing residue is formed into ammonium containing compounds; stopping the flow of the dry clean gas; and removing the silicon substrate, silicon wafer, a source layer, the drain layer, or the polysilicon layer from the plasma processing chamber.

14 . The method, as recited in claim 1 , wherein the etch gas is a halogen containing etch gas.

15 . The method, as recited in claim 1 , wherein the silicon containing residues comprise at least one of silicon oxide, SiBr x , SiCl x , SiON, SiO x F y , SiCO, SiO x Cl y , or SiO x Br y , where x and y are positive integers.

16 . A method for etching features into a silicon containing etch layer, comprising
placing the etch layer into a plasma processing chamber; flowing a halogen containing etch gas into the plasma processing chamber; forming the halogen containing etch gas into an etch plasma, wherein the silicon containing etch layer is exposed to the etch plasma, and wherein the etch plasma etches features into the silicon containing layer leaving silicon containing residue, wherein the silicon containing residues comprise at least one of silicon oxide, SiBr x , SiCl x , SiON, SiO x F y , SiCO, SiO x Cl y , or SiO x Br y , where x and y are positive integers; stopping the flow of etch gas into the plasma processing chamber; flowing a dry clean gas into the plasma processing chamber, wherein the dry clean gas comprises NH 3 and NF 3 , wherein the dry clean gas has a ratio of the flow of NH 3 to NF 3 of between 1:1 to 20:1; forming the dry clean gas into a non-remote plasma, wherein the silicon containing residue is exposed to the dry clean gas non-remote plasma, and wherein at least some of the silicon containing residue is formed into ammonium containing compounds; stopping the flow of the dry clean gas; sublimating the ammonium containing compounds at a temperature between 60° to 220° C.; and removing the etch layer from the plasma processing chamber.

17 . The method, as recited in claim 16 , wherein the etch layer is a silicon substrate, silicon wafer, a gate, a shallow trench isolation layer, a source layer, a drain layer, or a polysilicon layer.

18 . An apparatus for etching features into a silicon containing etch layer, comprising:
a plasma processing chamber, comprising:
a chamber wall forming a plasma processing chamber enclosure;
a substrate support for supporting a wafer within the plasma processing chamber enclosure;
a pressure regulator for regulating the pressure in the plasma processing chamber enclosure;
at least one electrode for providing power to the plasma processing chamber enclosure for sustaining a plasma;
a gas inlet for providing gas into the plasma processing chamber enclosure; and
a gas outlet for exhausting gas from the plasma processing chamber enclosure;
at least one RF power source electrically connected to the at least one electrode; a heater for heating the silicon containing etch layer a gas source in fluid connection with the gas inlet, the gas source comprising:
an etch gas source;
a NH 3 gas source; and
a NF 3 gas source; and
a controller controllably connected to the gas source and the at least one RF power source, comprising:
at least one processor; and
computer readable media, comprising:
computer readable code for flowing an etch gas from the etch gas source into the plasma processing chamber;
computer readable code for transforming the etch gas into an etch plasma, which etches features into the silicon containing etch layer leaving silicon containing residue;
computer readable code for stopping the flow of the etch gas;
computer readable code for flowing a dry clean gas comprising NH 3 from the NH 3 gas source and NF 3 from the NF 3 gas source into the plasma processing chamber;
computer readable code for transforming the dry clean gas into an dry clean plasma, which transforms at least some of the silicon containing residue into ammonium containing co

Assignees

• Lam Res Corp

Inventors

• Kamp Tom A
• Paterson Alexander M
• Rastgar Neema

Classifications

• H10P70/273

  the processing being a delineation of conductive layers, e.g. by RIE · CPC title

• H10P70/20

  Cleaning during device manufacture · CPC title

• H10P50/268

  of silicon-containing layers · CPC title

• H10P50/242 Primary

  of Group IV materials · CPC title

• H01L21/3065 Primary

  Electricity · mapped topic