Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
US-12518981-B2 · Jan 6, 2026 · US
Kamimura Daigi is listed as an inventor on 40 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kamimura Daigi |
| Total patents | 40 |
| First publication | Oct 12, 2017 |
| Latest publication | Jan 6, 2026 |
Publications ranked by popularity score, then publication date.
US-12518981-B2 · Jan 6, 2026 · US
US-2025201585-A1 · Jun 19, 2025 · US
US-12293939-B2 · May 6, 2025 · US
US-12123091-B2 · Oct 22, 2024 · US
US-12116666-B2 · Oct 15, 2024 · US
US-2024339337-A1 · Oct 10, 2024 · US
US-2024224238-A1 · Jul 4, 2024 · US
US-11935762-B2 · Mar 19, 2024 · US
US-2024038576-A1 · Feb 1, 2024 · US
US-11823946-B2 · Nov 21, 2023 · US
Latest publications not already listed above.
US-2023112057-A1 · Apr 13, 2023 · US
US-2023017917-A1 · Jan 19, 2023 · US
US-2023016879-A1 · Jan 19, 2023 · US
US-11555246-B2 · Jan 17, 2023 · US
US-2022392783-A1 · Dec 8, 2022 · US
US-11512392-B2 · Nov 29, 2022 · US
US-11456190-B2 · Sep 27, 2022 · US
US-11450536-B2 · Sep 20, 2022 · US
US-D939459-S · Dec 28, 2021 · US
US-2021305067-A1 · Sep 30, 2021 · US
US-2021246554-A1 · Aug 12, 2021 · US
US-2021217634-A1 · Jul 15, 2021 · US
US-11062918-B2 · Jul 13, 2021 · US
US-11015248-B2 · May 25, 2021 · US
US-10998205-B2 · May 4, 2021 · US
US-2021043485-A1 · Feb 11, 2021 · US
US-2020219756-A1 · Jul 9, 2020 · US
US-10636681-B2 · Apr 28, 2020 · US
US-2020090965-A1 · Mar 19, 2020 · US
US-2020013639-A1 · Jan 9, 2020 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Kokusai Electric Corp | 36 |
| Hitachi Int Electric Inc | 6 |
| Kokusai Electric Corpotation | 1 |
| Hitachit Kokusai Electric Inc | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/0402 | 36 |
| C23C16/4412 | 28 |
| H10P72/0434 | 25 |
| H01L21/67017 | 22 |
| H01L21/67109 | 19 |