Substrate processing apparatus and method of manufacturing semiconductor device

Patent metadata

Field	Value
Publication number	US-11555246-B2
Application number	US-202117246049-A
Country	US
Kind code	B2
Filing date	Apr 30, 2021
Priority date	May 25, 2018
Publication date	Jan 17, 2023
Grant date	Jan 17, 2023

Abstract

Described herein is a technique capable of suppressing a deviation in a thickness of a film formed on a substrate. According to one aspect of the technique of the present disclosure, a substrate processing apparatus includes a substrate retainer capable of supporting substrates; a cylindrical process chamber including a discharge part and supply holes; partition parts arranged in the circumferential direction to partition supply chambers communicating with the process chamber through the supply holes; nozzles provided with an ejection hole; and gas supply pipes. The supply chambers includes a first nozzle chamber and a second nozzle chamber, the process gas includes a source gas and an assist gas, the nozzles includes a first nozzle for the assist gas flows and a second nozzle disposed in the second nozzle chamber and through which the source gas flows, and the first nozzle is disposed adjacent to the second nozzle.

First claim

What is claimed is:

1. A substrate processing apparatus comprising:
a substrate retainer configured to support a substrate;
a tubular part having a process chamber configured to accommodate the substrate retainer, the tubular part comprising:
a discharge part configured to discharge a fluid in the process chamber to an outside thereof; and
a supply part configured to supply a process gas capable of processing the substrate into the process chamber and disposed at a position different from the discharge part;

a nozzle chamber configured to communicate with the process chamber through the supply part;
a plurality of nozzles arranged in the nozzle chamber in a circumferential direction and comprising:
a first nozzle extending in an axial direction and provided with, on a side surface thereof, a plurality of first ejection holes configured to eject the process gas flowing in the first nozzle into the process chamber through a plurality of first supply holes;
a second nozzle extending in the axial direction and provided with, on a side surface thereof, a plurality of second ejection holes configured to eject the process gas flowing in the second nozzle into the process chamber through a plurality of second supply holes; and
a third nozzle extending in the axial direction and provided with, on a side surface thereof, a plurality of third ejection holes configured to eject the process gas flowing in the third nozzle into the process chamber through a plurality of third supply holes; and

a plurality of gas supply pipes through which the plurality of the nozzles communicate with a plurality of gas supply sources, respectively, wherein
the process gas comprises a first gas, a second gas and a third gas, wherein at least one of the first gas and the second gas comprises an element constituting a film formed on the substrate,
the first nozzle comprises two gas nozzles, one of which is configured to eject the first gas and the other of which is configured to eject the third gas,
the second nozzle is provided in an axial direction of the tubular part and between the two gas nozzles of the first nozzle such that the third gas is supplied while the first gas is being ejected through the first nozzle and the second gas is supplied while the first gas is not being ejected through the first nozzle,
the third nozzle comprises two gas nozzles provided adjacent to each of the two gas nozzles of the first nozzle, respectively, and configured to eject the third gas, and
a supply amount or a flow rate of the third gas ejected through the plurality of the first ejection holes or the plurality of the third ejection holes is less than a supply amount and a flow rate of the second gas ejected through the plurality of the second ejection holes, while the second nozzle ejects the second gas.

2. The substrate processing apparatus of claim 1 , wherein the second nozzle is interposed between the two gas nozzles of the third nozzle in the circumferential direction, and
one of the two gas nozzles of the third nozzle is disposed opposite to the second nozzle in a manner that one of the two gas nozzles of the first nozzle is interposed therebetween, and the other of the two gas nozzles of the third nozzle is disposed opposite to the second nozzle in a manner that the other of the two gas nozzles of the first nozzle is interposed therebetween.

3. The substrate processing apparatus of claim 1 , wherein the nozzle chamber comprises a first nozzle chamber, a second nozzle chamber and a third nozzle chamber, consecutively disposed in the circumferential direction at an outer circumference side of the tubular part,
the second nozzle is disposed in the second nozzle chamber,
the first nozzle is disposed in each of the first nozzle chamber and the third nozzle chamber, and
the third nozzle is disposed either at both sides of the second nozzle in the second nozzle chamber or in each of the first nozzle chamber and the third nozzle chamber.

4. The substrate processing apparatus of claim 1 , wherein an ejection time period during which the third gas is ejected through either the first nozzle or the third nozzle at least partly overlaps with an ejection time period during which the second gas is ejected through the second nozzle, and
the first ejection holes of the first nozzle, the second ejection holes of the second nozzle and the third ejection holes of the third nozzle are open toward a center of the substrate or parallel to one another.

5. The substrate processing apparatus of claim 1 , wherein the first nozzle is further configured to intermittently eject the third gas, in a state where neither of the first gas and the second gas is being supplied into the process chamber.

6. The substrate processing apparatus of claim 1 , wherein a region where the first ejection holes of the first nozzle and the second ejection holes of the second nozzle are formed covers a substrate arrangement region wherein a plurality of substrates including the substrate are disposed, and
the third nozzle is provided with the third ejection holes disposed at least one of an upper portion and a lower portion of the substrate arrangement region without any third ejection hole being disposed at a center portion between the upper portion and the lower portion of the substrate arrangement region.

7. The substrate processing apparatus of claim 1 , wherein the first nozzle is provided with the plurality of the first ejection holes corresponding to a plurality of substrates including the substrate,
the second nozzle is provided with the plurality of the second ejection holes corresponding to the plurality of the substrates,
the plurality of the first supply holes, the plurality of the second supply holes, and the plurality of the third supply holes are horizontal slits extending in a horizontal direction, and
each of the slits corresponds to the plurality of the substrates, respectively.

8. The substrate processing apparatus of claim 1 , wherein the second nozzle has a U-shape folded at an upper end thereof,
a second gas supply source and a third gas supply source are fluidly connected to one or more of the plurality of the gas supply pipes communicating with one end of the second nozzle, and a gas discharge pipe is connected to other end of the second nozzle such that an inside of the second nozzle is purged with an inert gas.

9. The substrate processing apparatus of claim 1 , wherein the third nozzle comprises the plurality of the third ejection holes disposed in two rows, and the second nozzle comprises a plurality of communication holes installed inside of the third nozzle and configured to communicate with an outside of the third nozzle between two rows of the first nozzle such that the second nozzle and the third nozzle simultaneously eject the second gas and the third gas, respectively.

10. A method of manufacturing a semiconductor device comprising:
providing the substrate processing apparatus of claim 1 , and
processing a substrate by performing:
(a) ejecting the second gas into the process chamber through the second nozzle while ejecting the third gas into the process chamber through the first or the third nozzle; and
(b) ejecting the first gas into the process chamber through the first nozzle.

11. A substrate processing apparatus comprising:
a substrate retainer configured to support a substrate;
a tubular part having a process chamber configured to accommodate the substrate retainer, the tubular part comprising:
a discharge part configured to discharge a fluid in the process chamber to an outside thereof; and
a supply part configured to supply a process gas capable of processing the substrate into the process chamber and

Assignees

• Kokusai Electric Corp

Inventors

• Shimada Hironori
• Kamimura Daigi

Classifications

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P72/0434

  mainly by convection · CPC title

• H10P72/0402 Primary

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• H10P72/70

  for supporting or gripping · CPC title

• H10P72/04

  Apparatus for manufacture or treatment · CPC title