Doping processes in metal interconnect structures
US-2026068630-A1 · Mar 5, 2026 · US
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Joi Aniruddha patents
Joi Aniruddha is listed as an inventor on 37 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Joi Aniruddha |
| Total patents | 37 |
| First publication | Aug 20, 2015 |
| Latest publication | Mar 5, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Doping processes in metal interconnect structures
US-12564039-B2 · Feb 24, 2026 · US
Simultaneous dielectric etch with metal passivation
US-2025308919-A1 · Oct 2, 2025 · US
Multiple State Pulsing for High Aspect Ratio Etch
US-2025210364-A1 · Jun 26, 2025 · US
Multiple state pulsing for high aspect ratio etch
US-12278112-B2 · Apr 15, 2025 · US
Zincating and doping of metal liner for liner passivation and adhesion improvement
US-11984354-B2 · May 14, 2024 · US
Multiple State Pulsing for High Aspect Ratio Etch
US-2024120205-A1 · Apr 11, 2024 · US
Systems and methods for etching a high aspect ratio structure
US-2024120209-A1 · Apr 11, 2024 · US
Doping processes in metal interconnect structures
US-2022415819-A1 · Dec 29, 2022 · US
Metal liner passivation and adhesion enhancement by zinc doping
US-11424158-B2 · Aug 23, 2022 · US
Recent patents
Latest publications not already listed above.
Electrochemical doping of thin metal layers employing underpotential deposition and thermal treatment
US-11225714-B2 · Jan 18, 2022 · US
Zincating and doping of metal liner for liner passivation and adhesion improvement
US-2021166971-A1 · Jun 3, 2021 · US
Metal liner passivation and adhesion enhancement by zinc doping
US-2020365453-A1 · Nov 19, 2020 · US
Metal liner passivation and adhesion enhancement by zinc doping
US-10741440-B2 · Aug 11, 2020 · US
Selective electroless electrochemical atomic layer deposition in an aqueous solution without external voltage bias
US-10640874-B2 · May 5, 2020 · US
Electrochemical doping of thin metal layers employing underpotential deposition and thermal treatment
US-2020063256-A1 · Feb 27, 2020 · US
Layer-by-layer deposition using hydrogen
US-10508351-B2 · Dec 17, 2019 · US
Electrochemical doping of thin metal layers employing underpotential deposition and thermal treatment
US-10501846-B2 · Dec 10, 2019 · US
Metal liner passivation and adhesion enhancement by zinc doping
US-2019371659-A1 · Dec 5, 2019 · US
Self-forming barrier process
US-10483163-B2 · Nov 19, 2019 · US
Self-forming barrier process
US-2019122922-A1 · Apr 25, 2019 · US
Electrochemical doping of thin metal layers employing underpotential deposition and thermal treatment
US-2019078202-A1 · Mar 14, 2019 · US
Selective electroless electrochemical atomic layer deposition in an aqueous solution without external voltage bias
US-2019048472-A1 · Feb 14, 2019 · US
Self-forming barrier process
US-2018374747-A1 · Dec 27, 2018 · US
Self-forming barrier process
US-10163695-B1 · Dec 25, 2018 · US
Layer-by-layer deposition using hydrogen
US-2018266001-A1 · Sep 20, 2018 · US
Method for a non-aqueous electroless polyol deposition of metal or metal alloy in features of a substrate
US-2017073815-A1 · Mar 16, 2017 · US
Electroless deposition of continuous platinum layer using complexed Co2+ metal ion reducing agent
US-9499913-B2 · Nov 22, 2016 · US
Selective deposition and co-deposition processes for ferromagnetic thin films
US-9476124-B2 · Oct 25, 2016 · US
Electroless deposition of continuous platinum layer
US-9469902-B2 · Oct 18, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 37 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/033 | 18 |
| H10W20/0552 | 17 |
| H10W20/425 | 15 |
| H10W20/076 | 13 |
| C23C18/1651 | 13 |