Iron-cobalt based target
US-12557559-B2 · Feb 17, 2026 · US
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Huang Wei-Chih patents
Huang Wei-Chih is listed as an inventor on 26 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Huang Wei-Chih |
| Total patents | 26 |
| First publication | May 18, 2017 |
| Latest publication | Feb 17, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Component firmware replacements via networks
US-12511196-B2 · Dec 30, 2025 · US
Component Firmware Replacements via Networks
US-2024289223-A1 · Aug 29, 2024 · US
Evaluating method for useful lifespan of conductive gel and non-implantable electrical stimulation device
US-2024033500-A1 · Feb 1, 2024 · US
Operationalization of memories using memory information sets
US-2024012572-A1 · Jan 11, 2024 · US
Ferromagnetic free layer, laminated strucure comprising the same, magnetic tunnel junction structure, magnetoresistive random access memory, and iron-cobalt based target
US-2023397503-A1 · Dec 7, 2023 · US
Bios passwords
US-2023222202-A1 · Jul 13, 2023 · US
Conductive external connector structure and method of forming
US-11527504-B2 · Dec 13, 2022 · US
Charge determination
US-2022302729-A1 · Sep 22, 2022 · US
Disinfecting light fixture having detection device
US-2022001054-A1 · Jan 6, 2022 · US
Recent patents
Latest publications not already listed above.
Composite electrode material and method for manufacturing the same, composite electrode containing the said composite electrode material, and Li-based battery comprising the said composite electrode
US-11158850-B2 · Oct 26, 2021 · US
Composite electrode material and method for manufacturing the same
US-11005091-B2 · May 11, 2021 · US
Conductive External Connector Structure and Method of Forming
US-2020373267-A1 · Nov 26, 2020 · US
Conductive external connector structure and method of forming
US-10741513-B2 · Aug 11, 2020 · US
Package structure having a plurality of conductive balls with narrow width for ball waist
US-10535593-B2 · Jan 14, 2020 · US
Composite electrode material and method for manufacturing the same, composite electrode containing the said composite electrode material, and li-based battery comprising the said composite electrode
US-2019393488-A1 · Dec 26, 2019 · US
Package structure and method of fabricating the same
US-2019252304-A1 · Aug 15, 2019 · US
Conductive External Connector Structure and Method of Forming
US-2019131263-A1 · May 2, 2019 · US
Package structure having a plurality of conductive balls having narrow width for the ball waist
US-10276481-B2 · Apr 30, 2019 · US
Composite electrode material and method for manufacturing the same
US-2019067681-A1 · Feb 28, 2019 · US
Package structure and method of fabricating the same
US-2018374785-A1 · Dec 27, 2018 · US
Conductive external connector structure and method of forming
US-10163836-B2 · Dec 25, 2018 · US
Conductive External Connector Structure and Method of Forming
US-2018166409-A1 · Jun 14, 2018 · US
Lead-free solder composition
US-2018021896-A1 · Jan 25, 2018 · US
Conductive external connector structure and method of forming
US-9875979-B2 · Jan 23, 2018 · US
Conductive External Connector Structure and Method of Forming
US-2017141059-A1 · May 18, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 13 |
| Univ Nat Cheng Kung | 5 |
| Hewlett Packard Development Co | 5 |
| Solar Applied Materials Tech Corp | 2 |
| Univ Nat Tsing Hua | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/701 | 12 |
| H10W70/093 | 12 |
| H10W72/952 | 8 |
| H10W72/9415 | 8 |
| H10W72/923 | 8 |