Semiconductor devices and methods of manufacturing
US-12166025-B2 · Dec 10, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W70/093 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 11,993 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 666 |
| 2016 | 758 |
| 2017 | 1,038 |
| 2018 | 1,093 |
| 2019 | 1,164 |
| 2020 | 1,291 |
| 2021 | 1,281 |
| 2022 | 1,201 |
| 2023 | 1,176 |
| 2024 | 1,078 |
| 2025 | 1,019 |
| 2026 | 228 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Electronic device and method of manufacturing the same
US-2024404904-A1 · Dec 5, 2024 · US
Package architecture utilizing wafer to wafer bonding
US-2024379487-A1 · Nov 14, 2024 · US
Biometric sensor module for a smart card and method for manufacturing such a module
US-12131987-B2 · Oct 29, 2024 · US
Package formation methods including coupling a molded routing layer to an integrated routing layer
US-2024355697-A1 · Oct 24, 2024 · US
Semiconductor substrate and manufacturing method thereof
US-2024274520-A1 · Aug 15, 2024 · US
Method for fabricating three-dimensional semiconductor device using buried stop layer in substrate
US-2024268119-A1 · Aug 8, 2024 · US
Method for fabricating a semiconductor device including an embedded semiconductor die
US-2024250004-A1 · Jul 25, 2024 · US
Integrated fan-out package and manufacturing method thereof
US-2024178120-A1 · May 30, 2024 · US
Package structure and method of manufacturing the same
US-2024105664-A1 · Mar 28, 2024 · US
Workpiece chuck, workpiece handling apparatus, manufacturing method of semiconductor package
US-2024063048-A1 · Feb 22, 2024 · US
Semiconductor structure and manufacturing method thereof
US-2024063101-A1 · Feb 22, 2024 · US
Head assembly for mounting conductive ball
US-2024009747-A1 · Jan 11, 2024 · US
Intelligent power module and manufacturing method thereof
US-2024006280-A1 · Jan 4, 2024 · US
Multiple bond via arrays of different wire heights on a same substrate
US-2015380377-A1 · Dec 31, 2015 · US
Method for manufacturing semiconductor device
US-2015380274-A1 · Dec 31, 2015 · US
Semiconductor device and method of manufacturing semiconductor device
US-2015380347-A1 · Dec 31, 2015 · US
Methods of fabricating fan-out wafer level packages and packages formed by the methods
US-9202716-B2 · Dec 1, 2015 · US
Semiconductor arrangement, semiconductor module, and method for connecting a semiconductor chip to a ceramic substrate
US-9196562-B2 · Nov 24, 2015 · US
Off-chip vias in stacked chips
US-2015333042-A1 · Nov 19, 2015 · US
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W70/093?
- CPC H10W70/093 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H10W70/093 (Electricity)?
- Our database includes 11,993 publications tagged with this CPC code.
- Is patent activity under CPC H10W70/093 growing?
- Publication counts under this code: 1,078 in 2024 vs 1,019 in 2025 (latest complete years).