Copper alloy bonding wire for semiconductor devices
US-2026097454-A1 · Apr 9, 2026 · US
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Haibara Teruo patents
Haibara Teruo is listed as an inventor on 63 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Haibara Teruo |
| Total patents | 63 |
| First publication | Feb 25, 2016 |
| Latest publication | Apr 9, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Al bonding wire
US-12532767-B2 · Jan 20, 2026 · US
AG alloy bonding wire for semiconductor devices and semiconductor device
US-12463172-B2 · Nov 4, 2025 · US
Bonding wire for semiconductor devices
US-12412864-B2 · Sep 9, 2025 · US
Al bonding wire
US-12388044-B2 · Aug 12, 2025 · US
Copper alloy bonding wire for semiconductor devices
US-12300658-B2 · May 13, 2025 · US
Bonding wire
US-12132025-B2 · Oct 29, 2024 · US
Al bonding wire
US-12090578-B2 · Sep 17, 2024 · US
Bonding wire for semiconductor devices
US-2024297142-A1 · Sep 5, 2024 · US
Bonding wire for semiconductor devices
US-2024290745-A1 · Aug 29, 2024 · US
Recent patents
Latest publications not already listed above.
Bonding wire for semiconductor devices
US-2024290744-A1 · Aug 29, 2024 · US
Bonding wire for semiconductor devices
US-2024290743-A1 · Aug 29, 2024 · US
Bonding wire for semiconductor devices
US-11929343-B2 · Mar 12, 2024 · US
Bonding wire for semiconductor devices
US-2023387066-A1 · Nov 30, 2023 · US
Bonding wire for semiconductor devices
US-11721660-B2 · Aug 8, 2023 · US
Bonding wire for semiconductor devices
US-2023245995-A1 · Aug 3, 2023 · US
Bonding wire for semiconductor devices
US-2023215834-A1 · Jul 6, 2023 · US
Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE
US-2023154884-A1 · May 18, 2023 · US
Al bonding wire
US-2023146315-A1 · May 11, 2023 · US
Al bonding wire
US-2023142531-A1 · May 11, 2023 · US
Copper alloy bonding wire for semiconductor devices
US-2023018430-A1 · Jan 19, 2023 · US
Bonding wire for semiconductor device
US-11373934-B2 · Jun 28, 2022 · US
Bonding wire for semiconductor devices
US-11342299-B2 · May 24, 2022 · US
Al bonding wire
US-2022152749-A1 · May 19, 2022 · US
Bonding wire
US-2022157766-A1 · May 19, 2022 · US
Bonding wire for semiconductor devices
US-2022108971-A1 · Apr 7, 2022 · US
Cu pillar cylindrical preform for semiconductor connection
US-11101234-B2 · Aug 24, 2021 · US
Copper alloy bonding wire for semiconductor devices
US-2020312808-A1 · Oct 1, 2020 · US
Bonding wire for semiconductor device
US-10737356-B2 · Aug 11, 2020 · US
Cu alloy core bonding wire with Pd coating for semiconductor device
US-10672733-B2 · Jun 2, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Nippon Micrometal Corp | 56 |
| Nippon Steel & Sumikin Mat Co | 25 |
| Nippon Steel Chemical & Mat Co Ltd | 25 |
| Siltronic Ag | 7 |
| Haibara Teruo | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01L24/45 | 53 |
| H10W72/552 | 50 |
| H10W72/50 | 48 |
| H10W72/01565 | 48 |
| H10W72/5522 | 46 |