Method and apparatus for laser drilling blind vias
US-2025281998-A1 · Sep 11, 2025 · US
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Gouk Roman patents
Gouk Roman is listed as an inventor on 70 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Gouk Roman |
| Total patents | 70 |
| First publication | Mar 24, 2015 |
| Latest publication | Sep 11, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Package core assembly and fabrication methods
US-12374611-B2 · Jul 29, 2025 · US
Method and apparatus for laser drilling blind vias
US-12358073-B2 · Jul 15, 2025 · US
Package core assembly and fabrication methods
US-12087679-B2 · Sep 10, 2024 · US
Fluoropolymer stamp fabrication method
US-11927885-B2 · Mar 12, 2024 · US
Package core assembly and fabrication methods
US-11881447-B2 · Jan 23, 2024 · US
Package core assembly and fabrication methods
US-11862546-B2 · Jan 2, 2024 · US
Methods of forming microvias with reduced diameter
US-11798903-B2 · Oct 24, 2023 · US
Methods of micro-via formation for advanced packaging
US-11705365-B2 · Jul 18, 2023 · US
Fluoropolymer stamp fabrication method
US-2022373883-A1 · Nov 24, 2022 · US
Recent patents
Latest publications not already listed above.
Methods of micro-via formation for advanced packaging
US-2022375787-A1 · Nov 24, 2022 · US
Fluoropolymer stamp fabrication method
US-11454884-B2 · Sep 27, 2022 · US
Drying process for high aspect ratio features
US-11424137-B2 · Aug 23, 2022 · US
Methods Of Forming Microvias With Reduced Diameter
US-2022246558-A1 · Aug 4, 2022 · US
Method for via formation by micro-imprinting
US-2022171281-A1 · Jun 2, 2022 · US
Methods of forming microvias with reduced diameter
US-11315890-B2 · Apr 26, 2022 · US
Method for via formation by micro-imprinting
US-11281094-B2 · Mar 22, 2022 · US
Methods Of Forming Microvias With Reduced Diameter
US-2022051999-A1 · Feb 17, 2022 · US
Method and apparatus for laser drilling blind vias
US-2022044936-A1 · Feb 10, 2022 · US
Method and apparatus for laser drilling blind vias
US-11232951-B1 · Jan 25, 2022 · US
Method and apparatus for laser drilling blind vias
US-2022020590-A1 · Jan 20, 2022 · US
Fluoropolymer stamp fabrication method
US-2021325776-A1 · Oct 21, 2021 · US
Reduced volume processing chamber
US-11133174-B2 · Sep 28, 2021 · US
Package core assembly and fabrication methods
US-2021257289-A1 · Aug 19, 2021 · US
Package core assembly and fabrication methods
US-2021249345-A1 · Aug 12, 2021 · US
Package core assembly and fabrication methods
US-2021159160-A1 · May 27, 2021 · US
Package core assembly and fabrication methods
US-2021159158-A1 · May 27, 2021 · US
Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device structures
US-11011392-B2 · May 18, 2021 · US
Package structure with embedded core
US-10937726-B1 · Mar 2, 2021 · US
Method for copper plating through silicon vias using wet wafer back contact
US-10879116-B2 · Dec 29, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 69 |
| Applied Materials Inc | 1 |
| Hilkene Martin A | 1 |
| Gouk Roman | 1 |
| Scotney-Castle Matthew D | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P70/80 | 22 |
| H01L21/02101 | 21 |
| H10P72/0408 | 20 |
| H01L21/67034 | 19 |
| H10W70/095 | 17 |