Corrosion tolerant micro-electromechanical fluid ejection device
US-12491716-B2 · Dec 9, 2025 · US
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Fuller Anthony M patents
Fuller Anthony M is listed as an inventor on 66 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Fuller Anthony M |
| Total patents | 66 |
| First publication | Feb 24, 2015 |
| Latest publication | Dec 9, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Fluid ejection device with break(s) in cover layer
US-12391044-B2 · Aug 19, 2025 · US
Corrosion tolerant micro-electromechanical fluid ejection device
US-2023415482-A1 · Dec 28, 2023 · US
Applying mold chase structure to end portion of fluid ejection die
US-11827021-B2 · Nov 28, 2023 · US
Fluid ejection device with break(s) in cover layer
US-2023356527-A1 · Nov 9, 2023 · US
Corrosion tolerant micro-electromechanical fluid ejection device
US-11787180-B2 · Oct 17, 2023 · US
Fluid ejection device with break(s) in cover layer
US-11745507-B2 · Sep 5, 2023 · US
Circuit die alignment target
US-11721636-B2 · Aug 8, 2023 · US
Die for a printhead
US-11642884-B2 · May 9, 2023 · US
Fluid ejection devices including contact pads
US-11639055-B2 · May 2, 2023 · US
Recent patents
Latest publications not already listed above.
Fluid ejection devices including contact pads
US-2022348013-A1 · Nov 3, 2022 · US
Fluid ejection devices including electrical interconnect elements for fluid ejection dies
US-11472180-B2 · Oct 18, 2022 · US
Fluid ejection devices including contact pads
US-11413865-B2 · Aug 16, 2022 · US
Die for a printhead
US-11413864-B2 · Aug 16, 2022 · US
Fluid ejection device with a carrier having a slot
US-11390081-B2 · Jul 19, 2022 · US
Die for a printhead
US-11383514-B2 · Jul 12, 2022 · US
Circulation path for bubbler
US-2022176708-A1 · Jun 9, 2022 · US
Fluid ejection device with break(s) in cover layer
US-2022072858-A1 · Mar 10, 2022 · US
Die for a printhead
US-11267243-B2 · Mar 8, 2022 · US
Manufacturing a corrosion tolerant micro-electromechanical fluid ejection device
US-2022048763-A1 · Feb 17, 2022 · US
A corrosion tolerant micro-electromechanical fluid ejection device
US-2022040977-A1 · Feb 10, 2022 · US
Applying mold chase structure to end portion of fluid ejection die
US-2022009231-A1 · Jan 13, 2022 · US
Circuit die alignment target
US-2021402782-A1 · Dec 30, 2021 · US
Die for a printhead
US-2021370671-A1 · Dec 2, 2021 · US
Die for a printhead
US-2021354462-A1 · Nov 18, 2021 · US
Die for a printhead
US-2021354461-A1 · Nov 18, 2021 · US
Die for a printhead
US-2021354460-A1 · Nov 18, 2021 · US
Fluid ejection devices including electrical interconnect elements for fluid ejection dies
US-2021260872-A1 · Aug 26, 2021 · US
Fluid ejection die molded into molded body
US-11097537-B2 · Aug 24, 2021 · US
Fluid ejection device with a carrier having a slot
US-2021229438-A1 · Jul 29, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Hewlett Packard Development Co | 49 |
| Hewlett Packard Development Co Lp | 17 |
| Mardilovich Peter | 7 |
| Fuller Anthony M | 7 |
| Wei Qingqiao | 7 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B41J2/14072 | 28 |
| B41J2/1433 | 23 |
| B41J2/1603 | 14 |
| B41J2/1637 | 13 |
| C25D11/045 | 13 |