Circuit Package
US-2018226316-A1 · Aug 9, 2018 · US
Fluid ejection devices including contact pads
US11413865B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11413865-B2 |
| Application number | US-201916768041-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 6, 2019 |
| Priority date | Feb 6, 2019 |
| Publication date | Aug 16, 2022 |
| Grant date | Aug 16, 2022 |
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- Title
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- Abstract
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- Assignees and inventors
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- Key dates
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- First independent claim
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- CPC / IPC classifications
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- Citations and related patents
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Abstract
Official abstract text for this publication.
A device includes a first column of contact pads. The device also includes a column of fluid actuation devices disposed longitudinally to the first column of contact pads.
First claim
Opening claim text (preview).
The invention claimed is: 1. A device comprising: a first column of contact pads; a column of fluid actuation devices disposed longitudinally to the first column of contact pads; and a second column of contact pads aligned with the first column of contact pads and at a distance from the first column of contact pads, wherein the first column of contact pads comprises a first high voltage power supply contact pad and a first high voltage power ground return contact pad, and wherein the second column of contact pads comprises a second high voltage power supply contact pad and a second high voltage power ground return contact pad. 2. The device of claim 1 , wherein the column of fluid actuation devices is arranged between the first column of contact pads and the second column of contact pads. 3. The device of claim 1 , wherein the first column of contact pads comprises six contact pads, and wherein the second column of contact pads comprises six contact pads. 4. The device of claim 1 , wherein the first column of contact pads comprises a logic power ground return contact pad, and wherein the second column of contact pads comprises a logic power supply contact pad. 5. The device of claim 1 , wherein the first column of contact pads comprises a data contact pad, a clock contact pad, and a multipurpose input/output contact pad, and wherein the second column of contact pads comprises a logic reset contact pad, a mode contact pad, and a fire contact pad. 6. The device of claim 1 , wherein the first high voltage power ground return contact pad is at the bottom of the first column, and wherein the second high voltage power ground return contact pad is at the top of the second column. 7. The device of claim 1 , wherein the first column of contact pads comprises a data contact pad at the top of the first column, and wherein the second column of contact pads comprises a fire contact pad at the bottom of the second column. 8. The device of claim 1 , wherein the first column of contact pads comprises the following contact pads in order: a data contact pad, a clock contact pad, a logic power ground return contact pad, a multipurpose input/output contact pad, the first high voltage power supply contact pad, and the first high voltage power ground return contact pad, and wherein the second column of contact pads comprises the following contact pads in order: the second high voltage power ground return contact pad, the second high voltage power supply contact pad, a logic reset input contact pad, a logic power supply contact pad, a mode contact pad, and a fire contact pad. 9. A device comprising: a first column of contact pads; a column of fluid actuation devices disposed longitudinally to the first column of contact pads; and a second column of contact pads aligned with the first column of contact pads and at a distance from the first column of contact pads, wherein the first column of contact pads is aligned with the column of fluid actuation devices, wherein the first column of contact pads comprises a data contact pad, a clock contact pad, and a multipurpose input/output contact pad, and wherein the second column of contact pads comprises a logic reset contact pad, a mode contact pad, and a fire contact pad. 10. A fluid ejection die comprising: a first column of contact pads; a second column of contact pads aligned with the first column of contact pads; and a column of fluid actuation devices between the first column and the second column, wherein the first column of contact pads is aligned with the column of fluid actuation devices, wherein the first column of contact pads comprises a first high voltage power ground return contact pad at the bottom of the first column, and wherein the second column of contact pads comprises a second high voltage power ground return contact pad at the top of the second column. 11. The fluid ejection die of claim 10 , wherein the first column of contact pads comprises a first high voltage power supply contact pad directly above the first high voltage power ground return contact pad, and wherein the second column of contact pads comprises a second high voltage power supply contact pad directly below the second high voltage power ground return contact pad. 12. The fluid ejection die of claim 10 , wherein the first column of contact pads comprises a logic power ground return contact pad, and wherein the second column of contact pads comprises a logic power supply contact pad. 13. A fluid ejection die comprising: a first column of contact pads; a second column of contact pads aligned with the first column of contact pads; and a column of fluid actuation devices between the first column and the second column, wherein the first column of contact pads is aligned with the column of fluid actuation devices, wherein the first column of contact pads comprises a data contact pad at the top of the first column, and wherein the second column of contact pads comprises a fire contact pad at the bottom of the second column. 14. A fluid ejection die comprising: a first column of contact pads; a second column of contact pads aligned with the first column of contact pads; and a column of fluid actuation devices between the first column and the second column, wherein the first column of contact pads is aligned with the column of fluid actuation devices, wherein the first column of contact pads comprises the following contact pads in order: a data contact pad, a clock contact pad, a logic power ground return contact pad, a multipurpose input/output contact pad, a first high voltage power supply contact pad, and a first high voltage power ground return contact pad, and wherein the second column of contact pads comprises the following contact pads in order: a second high voltage power ground return contact pad, a second high voltage power supply contact pad, a logic reset input contact pad, a logic power supply contact pad, a mode contact pad, and a fire contact pad.
Assignees
Inventors
Classifications
Control methods or devices therefor, e.g. driver circuits, control circuits · CPC title
- B41J2/14072Primary
Electrical connections, e.g. details on electrodes, connecting the chip to the outside... · CPC title
Patent family
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External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US11413865B2 cover?
- A device includes a first column of contact pads. The device also includes a column of fluid actuation devices disposed longitudinally to the first column of contact pads.
- Who is the assignee on this patent?
- Hewlett Packard Development Co
- What technology area does this patent fall under?
- Primary CPC classification B41J2/14072. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Aug 16 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 9 related publications on this page (citations in our corpus or others sharing the same primary CPC).