Circuit die alignment target

Patent metadata

Field	Value
Publication number	US-11721636-B2
Application number	US-201816603821-A
Country	US
Kind code	B2
Filing date	Apr 15, 2018
Priority date	Apr 15, 2018
Publication date	Aug 8, 2023
Grant date	Aug 8, 2023

Abstract

A circuit die may include an outermost circuit layer having electrical transmission routing and an alignment target overlying the outermost circuit layer.

First claim

What is claimed is:

1. A circuit die assembly comprising:
a circuit die comprising:
an outermost circuit layer having electrical transmission routings;
a first alignment target overlying the outermost circuit layer;

a second alignment target formed at or below the outermost circuit layer;
a bond pad region, wherein the second alignment target is within the bond pad region; and
an encapsulant covering the second alignment target while the first alignment target remains uncovered by the encapsulant.

2. The circuit die assembly of claim 1 , wherein the circuit die has a first width and wherein the first alignment target has a second width of at least 50 percent of the first width.

3. The circuit die assembly of claim 1 further comprising a non-circuit layer overlying the outermost circuit layer, the non-circuit layer having a recess, wherein the first alignment target is within the recess.

4. The circuit die assembly of claim 3 , wherein the recess comprises a channel extending from a first mouth to a second mouth and wherein the first alignment target extends within the channel from the mouth to the second mouth.

5. The circuit die assembly of claim 4 further comprising a molding in which the circuit die is at least partially embedded, the molding abutting the first side and the second side of the circuit die, wherein the molding and the first alignment target are formed from a same material.

6. The circuit die assembly of claim 5 , wherein the non-circuit layer comprises SU8 and wherein the same material comprises an epoxy mold compound.

7. The circuit die assembly of claim 6 , wherein the non-circuit layer comprises columns of orifices through which fluid is to be ejected.

8. The circuit die assembly of claim 1 , wherein the first alignment target has a shape selected from a group of shapes consisting of a ring, a U-shape and an x-shape.

9. A circuit assembly fabrication method comprising:
forming a first alignment target that overlies an outermost circuit layer of a circuit die, wherein forming the first alignment target comprises:
forming a recess in a non-circuit layer formed from a first material and overlying the outermost circuit layer of the circuit die; and
at least partially filling the recess with a second material different than the first material;

forming a second alignment target formed at or below the outermost circuit layer;
sensing light interaction with the first or the second alignment target; and
determining a position of the circuit die based upon the sensed light interaction.

10. The circuit assembly fabrication method of claim 9 , wherein the second material comprises a molding material, and wherein at least partially filling the recess with the molding material comprises:
supplying the molding material along at least one side of the circuit die;
flowing the molding material, while in a liquid state, through the recess formed in the non-circuit layer overlying the outermost circuit layer to at least partially fill the recess with the molding material; and
solidifying the molding material within the channel, wherein the solidified material within the channel forms the alignment target.

11. A fluid cartridge comprising:
a housing;
a fluid ejection die coupled to the housing, the fluid ejection die comprising:
an outermost circuit layer having electrical transmission routings;
a first alignment target overlying the outermost circuit layer; and
a second alignment target formed at or below the outermost circuit layer; and
a molding coupled to the housing, wherein the fluid ejection die is at least partially embedded in the molding, and wherein a material of the molding at least partially fills a groove in a face of the fluid ejection die to form the first alignment target.

Assignees

• Hewlett Packard Development Co

Inventors

• Fuller Anthony M
• Cumbie Michael W
• Chen Chien-Hua

Classifications

• H10P72/50

  for positioning, orientation or alignment · CPC title

• H10W46/301

  for alignment · CPC title

• H10W46/603

  Formed on wafers or substrates before dicing and remaining on chips after dicing · CPC title

• H10W46/601

  for use after dicing · CPC title

• H10W46/101

  characterised by the type of information, e.g. logos or symbols · CPC title