Die for a printhead

Patent metadata

Field	Value
Publication number	US-11642884-B2
Application number	US-201916766525-A
Country	US
Kind code	B2
Filing date	Feb 6, 2019
Priority date	Feb 6, 2019
Publication date	May 9, 2023
Grant date	May 9, 2023

Abstract

A die for a printhead is described herein. The die includes a number of fluid feed holes disposed in a line parallel to a longitudinal axis of the die, wherein the fluid feed holes are formed through a substrate of the die. The die includes a number of fluidic actuators, proximate to the fluid feed holes, to eject fluid received from the fluid feed holes. Circuitry on the die operates the fluidic actuators, wherein traces are provided in layers between adjacent fluid feed holes, connecting circuitry on each side of the fluid feed holes.

First claim

What is claimed is:

1. A die for a printhead, comprising:
a substrate having a plurality of fluid feed holes formed through the substrate, the plurality of fluid feed holes disposed in a line parallel to a longitudinal axis of the die;
a plurality of fluidic actuators, proximate to the plurality of fluid feed holes, to eject fluid received from the plurality of fluid feed holes;
logic circuitry and logic power lines disposed on a first side of the plurality of fluid feed holes, the logic circuitry to operate the plurality of fluidic actuators, the logic power lines being low-voltage power lines:
power circuitry and power circuit power lines disposed on a second side of the plurality of fluid feed holes opposite the first side, the power circuitry to provide power to the plurality of fluidic actuators, the power circuit power lines being high-voltage power lines: and
traces in layers between adjacent fluid feed holes of the plurality of fluid feed holes, connecting the logic circuitry and the power circuitry on each side of the plurality of fluid feed holes.

2. The die of claim 1 , wherein the plurality of fluidic actuators is parallel to the plurality of fluid feed holes, and defines a swath length.

3. The die of claim 1 , wherein the power circuitry power lines include a shared common ground and a shared supply bus to provide power to the power circuitry.

4. The die of claim 1 , further including a plurality of die zones, including:
a logic power zone along one edge of the die, including a common logic power line and a common logic ground line;
an address line zone;
an address logic zone, including address logic for selecting a fluidic actuator from a group of fluidic actuators in the plurality of fluidic actuators;
a memory zone, including a memory element for each group of fluidic actuators in the plurality of fluidic actuators;
a feed zone, including the plurality of fluid feed holes;
a power circuitry zone, including thermal resistor power circuitry to power thermal resistors for each of the plurality of fluidic actuators; and
a power zone, including a shared power bus and a shared common ground for the thermal resistor power circuitry.

5. The die of claim 4 , further including:
a first fluidic actuator zone, including portion of the plurality of fluidic actuators, and disposed along one side of the feed zone; and
a second fluidic actuator zone, including another portion of the plurality of fluidic actuators, and disposed along an opposite side of the feed zone from the first fluidic actuator zone.

6. The die of claim 1 , further including a fluidic actuator zone including the plurality of fluidic actuators wherein the plurality of fluidic actuators is disposed in a line parallel to the longitudinal axis and on one side of the plurality of fluid feed holes, and wherein larger fluidic actuators alternate with smaller fluidic actuators.

7. The die of claim 1 , wherein the die has a thickness of less than about 400 μm.

8. The die of claim 1 , wherein the die has a width of less than about 750 μm.

9. The die of claim 1 , wherein the die has a length of less than about 20 mm.

10. A printhead, comprising:
a die including:
a substrate having a plurality of fluid feed holes formed through the substrate, the plurality of fluid feed holes disposed in a line;
a plurality of fluidic actuators, proximate to the plurality of fluid feed holes, to eject fluid received from the plurality of fluid feed holes;
logic circuitry and logic power lines disposed on a first side of the plurality of fluid feed holes, the logic circuitry to operate the plurality of fluidic actuators, the logic power lines being low-voltage power lines:
power circuitry and power circuit power lines disposed on a second side of the plurality of fluid feed holes opposite the first side, the power circuitry to provide power to the plurality of fluidic actuators, the power circuit power lines being high-voltage power lines: and
traces in layers between adjacent fluid feed holes of the plurality of fluid feed holes and connecting the logic circuitry and the power circuitry; and
a polymeric mount, formed to hold the die along edges, including a slot along a back of the polymeric mount to feed fluid to the plurality of fluid feed holes.

11. The printhead of claim 10 , wherein the plurality of fluidic actuators is disposed on each side of the plurality of fluid feed holes, and wherein the plurality of fluidic actuators on one side of the plurality of fluid feed holes is offset from the plurality of fluidic actuators on the opposite side of the plurality of fluid feed holes.

12. The printhead of claim 10 , wherein the plurality of fluidic actuators is disposed in a line on a single side of the plurality of fluid feed holes, and wherein the plurality of fluidic actuators includes alternating large fluidic actuators and small fluidic actuators.

13. The printhead of claim 10 , wherein the die includes a plurality of die zones, and wherein the plurality of die zones includes:
a logic power zone along one edge of the die, including a common logic power line and a common logic ground line;
an address line zone;
an address logic zone, including address logic for selecting a fluidic actuator from a group of fluidic actuators in the plurality of fluidic actuators;
a memory zone, including a memory element for each group of fluidic actuators in the plurality of fluidic actuators;
a feed zone, including the plurality of fluid feed holes;
a power circuitry zone, including thermal resistor power circuitry to power thermal resistors for each of the plurality of fluidic actuators; and
a power zone, including a shared power bus and a shared common ground for the thermal resistor power circuitry.

Assignees

• Hewlett Packard Development Co

Inventors

• Cumbie Michael W
• Linn Scott A
• Fuller Anthony M
• Gardner James Michael

Classifications

• B41J2/14056

  Plural heating elements per ink chamber · CPC title

• B41J29/393

  Devices for controlling or analysing the entire machine {; Controlling or analysing mechanical parameters involving printing of test patterns} · CPC title

• B41J2/14072 Primary

  Electrical connections, e.g. details on electrodes, connecting the chip to the outside... · CPC title

• B41J2002/14491

  Electrical connection · CPC title

• B41J2202/13

  Heads having an integrated circuit · CPC title