Fluid ejection die molded into molded body

Patent metadata

Field	Value
Publication number	US-11097537-B2
Application number	US-201716485214-A
Country	US
Kind code	B2
Filing date	Apr 24, 2017
Priority date	Apr 24, 2017
Publication date	Aug 24, 2021
Grant date	Aug 24, 2021

Abstract

A fluid ejection device includes a molded body having a first molded surface and a second molded surface opposite the first molded surface, and a fluid ejection die molded into the molded body, with the fluid ejection die having a first surface substantially coplanar with the first molded surface of the molded body and a second surface substantially coplanar with the second molded surface of the molded body, with the first surface of the fluid ejection die having a plurality of fluid ejection orifices formed therein and the second surface of the fluid ejection die having at least one fluid feed slot formed therein.

First claim

The invention claimed is:

1. A fluid ejection device, comprising:
a molded body having a maximum molded thickness and including a first molded surface at the maximum molded thickness and a second molded surface at the maximum molded thickness opposite the first molded surface; and
a fluid ejection die molded into the molded body,
the fluid ejection die having a thickness and including a first surface coplanar with the first molded surface of the molded body and a second surface coplanar with the second molded surface of the molded body, the first surface of the fluid ejection die having a plurality of fluid ejection orifices formed therein and the second surface of the fluid ejection die having at least one fluid feed slot formed therein,
the maximum molded thickness of the molded body being equal to the thickness of the fluid ejection die.

2. The fluid ejection device of claim 1 , wherein the fluid ejection die includes a substrate and a fluid architecture supported by the substrate, the substrate comprising the second surface of the fluid ejection die and having the at least one fluid feed slot formed therein, and the fluid architecture providing the first surface of the fluid ejection die and including the plurality of fluid ejection orifices.

3. The fluid ejection device of claim 2 , wherein the fluid architecture includes a plurality of fluid ejection chambers each communicated with a respective one of the fluid ejection orifices and having a respective drop ejecting element therein.

4. The fluid ejection device of claim 2 , wherein the fluid architecture includes an orifice layer having the plurality of fluid ejection orifices formed therein, the orifice layer comprising the first surface of the fluid ejection die.

5. The fluid ejection device of claim 1 , wherein the substrate comprises a silicon substrate, and the molded body comprises an epoxy mold compound.

6. The fluid ejection device of claim 1 , wherein the fluid ejection die comprises a plurality of fluid ejection dies molded into the molded body, each of the fluid ejection dies having the first surface coplanar with the first molded surface of the molded body and the second surface coplanar with the second molded surface of the molded body.

7. A fluid ejection device, comprising:
a fluid ejection die having a thickness from a first surface to a second surface, the first surface having a plurality of fluid ejection orifices formed therein and the second surface having at least one fluid feed slot formed therein; and
a molded body molded around the fluid ejection die, the first surface of the fluid ejection die and the second surface of the fluid ejection die both exposed from the molded body, and a maximum molded thickness of the molded body being the same as the thickness of the fluid ejection die,
wherein the molded body has a first molded surface at the maximum molded thickness coplanar with the first surface of the fluid ejection die and a second molded surface at the maximum molded thickness opposite the first molded surface coplanar with the second surface of the fluid ejection die.

8. The fluid ejection device of claim 7 , wherein the fluid ejection die includes a substrate and a fluid architecture supported by the substrate, the substrate comprising the second surface of the fluid ejection die and having the at least one fluid feed slot formed therein, and the fluid architecture providing the first surface of the fluid ejection die and including the plurality of fluid ejection orifices.

9. The fluid ejection device of claim 7 , wherein the substrate comprises a silicon substrate, and the molded body comprises an epoxy mold compound.

10. A method of forming a fluid ejection device, comprising:
forming a molded body; and
molding a fluid ejection die into the molded body, including forming the molded body with a maximum molded thickness, forming a first molded surface of the molded body at the maximum molded thickness coplanar with a first surface of the fluid ejection die and forming a second molded surface of the molded body at the maximum molded thickness coplanar with a second surface of the fluid ejection die, the first surface of the fluid ejection die having a plurality of fluid ejection orifices formed therein, the second surface of the fluid ejection die having at least one fluid feed slot formed therein, the fluid ejection die having a thickness from the first surface to the second surface, and the maximum molded thickness of the molded body being equal to the thickness of the fluid ejection die.

11. The method of claim 10 , wherein molding the fluid ejection die into the molded body includes positioning the fluid ejection die on a carrier with the first surface of the fluid ejection die facing the carrier, and
positioning an upper mold chase over the fluid ejection die with the second surface of the fluid ejection die facing the upper mold chase.

12. The method of claim 11 , wherein positioning the upper mold chase over the fluid ejection die includes positioning a substantially planar surface of the upper mold chase over the at least one fluid feed slot and beyond opposite edges of the fluid ejection die.

13. The method of claim 11 , further comprising:
positioning a release liner between the second surface of the fluid ejection die and the upper mold chase.

14. The method of claim 10 , wherein the fluid ejection die includes a substrate and a fluid architecture supported by the substrate, the substrate comprising the second surface of the fluid ejection die and having the at least one fluid feed slot formed therein, and the fluid architecture providing the first surface of the fluid ejection die and including the plurality of fluid ejection orifices.

Assignees

• Hewlett Packard Development Co

Inventors

• Chen Chien-Hua
• Cumbie Michael W
• Fuller Anthony M

Classifications

• B41J2/14 Primary

  Structure thereof {only for on-demand ink jet heads} · CPC title

• B41J2202/20

  Modules · CPC title

• B41J2/1603 Primary

  of the front shooter type · CPC title

• B41J2/1637

  molding · CPC title