Fluid ejection devices including contact pads

Patent metadata

Field	Value
Publication number	US-11639055-B2
Application number	US-202217859432-A
Country	US
Kind code	B2
Filing date	Jul 7, 2022
Priority date	Feb 6, 2019
Publication date	May 2, 2023
Grant date	May 2, 2023

Abstract

A device includes a first column of contact pads. The device also includes a column of fluid actuation devices disposed longitudinally to the first column of contact pads.

First claim

The invention claimed is:

1. A device comprising:
a first column of contact pads; and
a column of fluid actuation devices disposed longitudinally to the first column of contact pads,
wherein the first column of contact pads is longitudinally aligned with the column of fluid actuation devices.

2. The device of claim 1 , further comprising:
a second column of contact pads aligned with the first column of contact pads and at a distance from the first column of contact pads.

3. The device of claim 2 , wherein the column of fluid actuation devices is arranged between the first column of contact pads and the second column of contact pads.

4. The device of claim 3 , wherein the first column of contact pads comprises six contact pads, and
wherein the second column of contact pads comprises six contact pads.

5. The device of claim 3 , wherein the first column of contact pads comprises a first high voltage power supply contact pad and a first high voltage power ground return contact pad, and
wherein the second column of contact pads comprises a second high voltage power supply contact pad and a second high voltage power ground return contact pad.

6. The device of claim 3 , wherein the first column of contact pads comprises a logic power ground return contact pad, and
wherein the second column of contact pads comprises a logic power supply contact pad.

7. The device of claim 3 , wherein the first column of contact pads comprises a data contact pad, a clock contact pad, and a multipurpose input/output contact pad, and
wherein the second column of contact pads comprises a logic reset contact pad, a mode contact pad, and a fire contact pad.

8. The device of claim 1 , further comprising:
an elongate substrate having a length, a thickness, and a width,
wherein the length is at least twenty times the width, and
wherein the first column of contact pads and the column of fluid actuation devices are arranged along the length of the elongate substrate.

9. A fluid ejection die comprising:
a first column of contact pads;
a second column of contact pads aligned with the first column of contact pads; and
a column of fluid actuation devices between the first column of contact pads and the second column of contact pads,
wherein the first column of contact pads, the second column of contact pads, and the column of fluid actuation devices are longitudinally aligned.

10. The fluid ejection die of claim 9 , wherein the first column of contact pads comprises a first high voltage power ground return contact pad at the bottom of the first column, and
wherein the second column of contact pads comprises a second high voltage power ground return contact pad at the top of the second column.

11. The fluid ejection die of claim 10 , wherein the first column of contact pads comprises a first high voltage power supply contact pad directly above the first high voltage power ground return contact pad, and
wherein the second column of contact pads comprises a second high voltage power supply contact pad directly below the second high voltage power ground return contact pad.

12. The fluid ejection die of claim 9 , wherein the first column of contact pads comprises a logic power ground return contact pad, and
wherein the second column of contact pads comprises a logic power supply contact pad.

13. The fluid ejection die of claim 9 , wherein the first column of contact pads comprises a data contact pad at the top of the first column, and
wherein the second column of contact pads comprises a fire contact pad at the bottom of the second column.

14. The fluid ejection die of claim 9 , wherein the first column of contact pads comprises the following contact pads in order: a data contact pad, a clock contact pad, a logic power ground return contact pad, a multipurpose input/output contact pad, a first high voltage power supply contact pad, and a first high voltage power ground return contact pad, and
wherein the second column of contact pads comprises the following contact pads in order: a second high voltage power ground return contact pad, a second high voltage power supply contact pad, a logic reset input contact pad, a logic power supply contact pad, a mode contact pad, and a fire contact pad.

15. The fluid ejection die of claim 9 , further comprising:
an elongate substrate having a length, a thickness, and a width,
wherein the length is at least twenty times the width, and
wherein the first column of contact pads, the second column of contact pads, and the column of fluid actuation devices are arranged along the length of the elongate substrate.

Assignees

• Hewlett Packard Development Co

Inventors

• Gardner James Michael
• Linn Scott A
• Cumbie Michael W
• Fuller Anthony M

Classifications

• B41J2/04501

  Control methods or devices therefor, e.g. driver circuits, control circuits · CPC title

• B41J2/14072 Primary

  Electrical connections, e.g. details on electrodes, connecting the chip to the outside... · CPC title