Printhead die
US-2016009082-A1 · Jan 14, 2016 · US
Fluid ejection device with a carrier having a slot
US11390081B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11390081-B2 |
| Application number | US-201916769907-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 6, 2019 |
| Priority date | Feb 6, 2019 |
| Publication date | Jul 19, 2022 |
| Grant date | Jul 19, 2022 |
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- Title
What the patent document calls the invention.
- Abstract
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- Assignees and inventors
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- Key dates
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- First independent claim
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- CPC / IPC classifications
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- Citations and related patents
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Abstract
Official abstract text for this publication.
A fluid ejection device includes a fluid ejection die including a first end portion positioned adjacent a first end of the fluid ejection die, and a fluid ejection portion positioned adjacent the first end portion. The fluid ejection die includes a contact pad positioned in the first end portion, and a fluid actuation device positioned in the fluid ejection portion. A carrier is attached to the fluid ejection die. The carrier includes a slot to provide fluid to the fluid actuation device. The slot extends longitudinally along the fluid ejection portion to a first slot end. A length from the first slot end to the first end of the fluid ejection die is less than 1.5 mm.
First claim
Opening claim text (preview).
The invention claimed is: 1. A fluid ejection device, comprising: a fluid ejection die including a first end portion positioned adjacent a first end of the fluid ejection die, and a fluid ejection portion positioned adjacent the first end portion and extending from the first end portion along an axis, wherein the fluid ejection die includes a contact pad positioned in the first end portion, and a fluid actuation device positioned in the fluid ejection portion; and a carrier attached to the fluid ejection die, wherein the carrier includes a slot to provide fluid to the fluid actuation device, wherein the slot extends longitudinally along the axis and the fluid ejection portion to a first slot end, and wherein a length along the axis from the first slot end to the first end of the fluid ejection die is less than 1.5 mm. 2. The fluid ejection device of claim 1 , wherein the first end is a first longitudinal end of the fluid ejection die. 3. The fluid ejection device of claim 1 , wherein the length from the first slot end to the first end of the fluid ejection die is less than 1.3 mm. 4. The fluid ejection device of claim 1 , wherein the length from the first slot end to the first end of the fluid ejection die is less than 1.1 mm. 5. The fluid ejection device of claim 1 , wherein the slot decreases in width from a first width along the fluid ejection portion to a second, smaller width along an end portion of the slot adjacent the first slot end. 6. The fluid ejection device of claim 1 , wherein the fluid ejection die includes a second end portion positioned adjacent a second end of the fluid ejection die, wherein the fluid ejection die includes a contact pad positioned in the second end portion, wherein the slot extends longitudinally along the fluid ejection portion to a second slot end, and wherein a length from the second slot end to the second end of the fluid ejection die is less than 1.5 mm. 7. The fluid ejection device of claim 6 , wherein the second end is a second longitudinal end of the fluid ejection die. 8. The fluid ejection device of claim 1 , wherein the carrier is a rigid carrier. 9. The fluid ejection device of claim 1 , wherein the carrier is a molded carrier, and the slot is a molded slot. 10. A fluid ejection device, comprising: a fluid ejection die including a first end portion positioned adjacent a first end of the fluid ejection die, a second end portion positioned adjacent a second end of the fluid ejection die, and a fluid ejection portion extending along an axis between the first and second end portions, wherein the fluid ejection die includes a fluid actuation device positioned in the fluid ejection portion; and a rigid carrier attached to the fluid ejection die, wherein the rigid carrier includes a slot to provide fluid to a back side of the fluid ejection die, wherein the slot extends longitudinally along the axis and the fluid ejection portion to a first slot end adjacent the first end portion, and wherein a length along the axis from the first slot end to the first end of the fluid ejection die is less than 1.5 mm. 11. The fluid ejection device of claim 10 , wherein the fluid ejection die includes a first contact pad positioned in the first end portion, and a second contact pad positioned in the second end portion. 12. The fluid ejection device of claim 10 , wherein the slot extends longitudinally along the fluid ejection portion to a second slot end adjacent the second end portion, and wherein a length from the second slot end to the second end of the fluid ejection die is less than 1.5 mm.
Assignees
Inventors
Classifications
- B41J2/1637Primary
molding · CPC title
characterised by specific geometrical characteristics · CPC title
- B41J2/1433Primary
Structure of nozzle plates · CPC title
Manufacturing of the nozzle plates · CPC title
Production of nozzles · CPC title
Patent family
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US11390081B2 cover?
- A fluid ejection device includes a fluid ejection die including a first end portion positioned adjacent a first end of the fluid ejection die, and a fluid ejection portion positioned adjacent the first end portion. The fluid ejection die includes a contact pad positioned in the first end portion, and a fluid actuation device positioned in the fluid ejection portion. A carrier is attached to the…
- Who is the assignee on this patent?
- Hewlett Packard Development Co
- What technology area does this patent fall under?
- Primary CPC classification B41J2/1637. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Jul 19 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).