Solder alloy, solder paste, and solder joint
US-12583061-B2 · Mar 24, 2026 · US
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DEI Kanta patents
DEI Kanta is listed as an inventor on 28 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | DEI Kanta |
| Total patents | 28 |
| First publication | Jan 7, 2021 |
| Latest publication | Mar 24, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Solder alloy, solder ball and solder joint
US-12583060-B2 · Mar 24, 2026 · US
Lead-free and antimony-free solder alloy, solder ball, and solder joint
US-12576463-B2 · Mar 17, 2026 · US
Solder alloy, solder paste, solder ball, solder preform, solder joint, in-vehicle electronic circuit, ECU electronic circuit, in-vehicle electronic circuit device and ECU electronic circuit device
US-12569941-B2 · Mar 10, 2026 · US
Solder alloy, solder ball, and solder joint
US-12447564-B2 · Oct 21, 2025 · US
Lead-Free and Antimony-Free Solder Alloy, Solder Ball, Ball Grid Array, and Solder Joint
US-2025276412-A1 · Sep 4, 2025 · US
Solder Alloy, Solder Paste, and Solder Joint
US-2025276411-A1 · Sep 4, 2025 · US
Lead-free and antimony-free solder alloy, solder ball, ball grid array, and solder joint
US-12383987-B2 · Aug 12, 2025 · US
Lead-free and antimony-free solder alloy, solder ball, and solder joint
US-12377500-B2 · Aug 5, 2025 · US
Solder Alloy, Solder Ball, Solder Preform, Solder Paste, and Solder Joint
US-2024399512-A1 · Dec 5, 2024 · US
Recent patents
Latest publications not already listed above.
Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, In-Vehicle Electronic Circuit, ECU Electronic Circuit, In-Vehicle Electronic Circuit Device and ECU Electronic Circuit Device
US-2024342838-A1 · Oct 17, 2024 · US
Layered bonding material, semiconductor package, and power module
US-12080671-B2 · Sep 3, 2024 · US
Solder alloy, solder paste, solder ball, solder preform, solder joint, in-vehicle electronic circuit, ECU electronic circuit, in-vehicle electronic circuit device and ECU electronic circuit device
US-12053843-B2 · Aug 6, 2024 · US
Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit Device
US-2024238914-A1 · Jul 18, 2024 · US
Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit Device
US-2024238913-A1 · Jul 18, 2024 · US
Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit Device
US-2024238912-A1 · Jul 18, 2024 · US
Layered bonding material, semiconductor package, and power module
US-2024213206-A1 · Jun 27, 2024 · US
Solder alloy, solder ball and solder joint
US-2023398643-A1 · Dec 14, 2023 · US
Solder Alloy, Solder Ball, and Solder Joint
US-2023129147-A1 · Apr 27, 2023 · US
Solder paste
US-11633815-B2 · Apr 25, 2023 · US
Solder alloy, cast article, formed article, and solder joint
US-11607753-B2 · Mar 21, 2023 · US
Lead-Free and Antimony-Free Solder Alloy, Solder Ball, and Solder Joint
US-2023068294-A1 · Mar 2, 2023 · US
Lead-Free and Antimony-Free Solder Alloy, Solder Ball, and Solder Joint
US-2023060857-A1 · Mar 2, 2023 · US
Solder alloy, solder paste, solder ball, solder preform, solder joint, in-vehicle electronic circuit, ecu electronic circuit, in-vehicle electronic circuit device and ecu electronic circuit device
US-2022355420-A1 · Nov 10, 2022 · US
Lead-Free and Antimony-Free Solder Alloy, Solder Ball, Ball Grid Array, and Solder Joint
US-2022324061-A1 · Oct 13, 2022 · US
Solder alloy, cast article, formed article, and solder joint
US-2022143761-A1 · May 12, 2022 · US
Solder paste
US-2021114143-A1 · Apr 22, 2021 · US
Solder alloy, solder paste, solder ball, resin flux-cored solder and solder joint
US-2021001431-A1 · Jan 7, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Senju Metal Industry Co | 28 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B23K35/262 | 28 |
| C22C13/00 | 23 |
| B23K35/0244 | 22 |
| C22C13/02 | 22 |
| B23K35/025 | 13 |