Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit Device
US-2024238914-A1 · Jul 18, 2024 · US
with antimony or bismuth as the next major constituent
with antimony or bismuth as the next major constituent · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C22C13/02 |
| Official title | with antimony or bismuth as the next major constituent |
| Display label | with antimony or bismuth as the next major constituent |
| Total patents | 366 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 20 |
| 2016 | 32 |
| 2017 | 26 |
| 2018 | 26 |
| 2019 | 42 |
| 2020 | 27 |
| 2021 | 35 |
| 2022 | 42 |
| 2023 | 42 |
| 2024 | 35 |
| 2025 | 29 |
| 2026 | 10 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Solder alloy, solder paste and electronic circuit board
US-2017355043-A1 · Dec 14, 2017 · US
Ni ball, Ni nuclear ball, solder joint, foam solder and solder paste
US-9816160-B2 · Nov 14, 2017 · US
High-temperature lead-free solder alloy
US-9796053-B2 · Oct 24, 2017 · US
Lead-free solder bump joining structure
US-2017259366-A1 · Sep 14, 2017 · US
METHOD FOR MANUFACTURING AN SnSb INTERMETALLIC PHASE
US-2017141388-A1 · May 18, 2017 · US
Metal material for electronic component and method for manufacturing the same
US-9576693-B2 · Feb 21, 2017 · US
Stable undercooled metallic particles for engineering at ambient conditions
US-2017014958-A1 · Jan 19, 2017 · US
High reliability lead-free solder alloys for harsh environment electronics applications
US-2016325384-A1 · Nov 10, 2016 · US
Tin-Antimony-Based High Temperature Solder for Downhole Components
US-2016311065-A1 · Oct 27, 2016 · US
Ni Ball, Ni Nuclear Ball, Solder Joint, Foam Solder and Solder Paste
US-2016304992-A1 · Oct 20, 2016 · US
Metal material for 3-dimensional printing, method for manufacturing the same, and method for 3-dimensional printing using the same
US-2016298215-A1 · Oct 13, 2016 · US
Lead-Free Solder Alloy and Semiconductor Device
US-2016300809-A1 · Oct 13, 2016 · US
Solder alloy, solder paste, and electronic circuit board
US-2016288271-A1 · Oct 6, 2016 · US
Lead-free solder alloy, electronic circuit board, and electronic control device
US-2016279741-A1 · Sep 29, 2016 · US
Solder alloy, solder composition, solder paste, and electronic circuit board
US-2016271737-A1 · Sep 22, 2016 · US
Solder alloy, solder paste, and electronic circuit board
US-9445508-B2 · Sep 13, 2016 · US
Lead-free solder alloy for printed circuit board assemblies for high-temperature environments
US-2016249462-A1 · Aug 25, 2016 · US
Joining method, method for producing electronic device and electronic part
US-9409247-B2 · Aug 9, 2016 · US
Lead-Free Solder, Lead-Free Solder Ball, Solder Joint Using the Lead-Free Solder and Semiconductor Circuit Having the Solder Joint
US-2016214212-A1 · Jul 28, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C22C13/02?
- CPC C22C13/02 is the Cooperative Patent Classification code for “with antimony or bismuth as the next major constituent.”
- How many patents are filed under CPC C22C13/02 (with antimony or bismuth as the next major constituent)?
- Our database includes 366 publications tagged with this CPC code.
- Is patent activity under CPC C22C13/02 growing?
- Publication counts under this code: 35 in 2024 vs 29 in 2025 (latest complete years).