Solder alloy, cast article, formed article, and solder joint

Patent metadata

Field	Value
Publication number	US-11607753-B2
Application number	US-202017603500-A
Country	US
Kind code	B2
Filing date	Jun 12, 2020
Priority date	Jun 28, 2019
Publication date	Mar 21, 2023
Grant date	Mar 21, 2023

Abstract

A solder alloy has an alloy composition consisting of, in mass %, Cu: 0.1% to 2.0%, Ni: 0.01% to 0.4%, P: 0.001% to 0.08%, and Ge: 0.001% to 0.08%, with the balance being Sn. The alloy composition satisfies the following relations (1) to (3): (Cu+5Ni)≤0.945% (relation (1)), (P+Ge)≤0.15% (relation (2)), 2.0≤(Cu+5Ni)/(P+Ge)≤1000 (relation (3)). In the above relations (1) to (3), Cu, Ni, P, and Ge each represents a content (mass %) thereof in the solder alloy.

First claim

The invention claimed is:

1. A solder alloy, having an alloy composition consisting of, in mass %:
Cu: 0.1% to 0.6%;
Ni: 0.01% to 0.4%;
P: 0.001% to 0.08%;
Ge: 0.001% to 0.08%; and
optionally at least one selected from the group consisting of Mn, Cr, Co, Si, Ti, and rare earth elements in a total amount of 1% or less,
with the balance being Sn, wherein
the alloy composition satisfies the following relations (1) to (3):

(

C
⁢

⁢
u

+

5
⁢
N
⁢

⁢
i

)

≤

0.945
⁢
%

Relation
⁢

⁢

(
1
)

(

P
+

G
⁢

⁢
e

)

≤

0.15
⁢
%

Relation
⁢

⁢

(
2
)

2.0
≤

(

C
⁢

⁢
u

+

5
⁢
N
⁢

⁢
i

)

/

(

P
+

G
⁢

⁢
e

)

≤
1000

Relation
⁢

⁢

(
3
)

wherein, in the above relations (1) to (3), Cu, Ni, P, and Ge each represents a content in mass % thereof in the solder alloy, and
when the solder alloy is used to produce a bar solder having a width of 10 mm and a length of 300 mm, the thickness of the bar solder is within a range of 7 mm±1 mm.

2. The solder alloy according to claim 1 , having the alloy composition consisting of, in mass %:
Cu: 0.1% to 0.6%;
Ni: 0.01% to 0.4%;
P: 0.001% to 0.08%; and
Ge: 0.001% to 0.08%, with the balance being Sn.

3. A cast product comprising the solder alloy according to claim 1 .

4. A cast product comprising the solder alloy according to claim 2 .

5. A formed product, formed from the cast product according to claim 3 .

6. A solder joint, obtained from the cast product according to claim 3 .

7. A formed product, formed from the cast product according to claim 4 .

8. A solder joint, obtained from the cast product according to claim 6 .

Assignees

• Senju Metal Industry Co

Inventors

• Yoshikawa Shunsaku
• Saito Takashi
• MATSUFUJI Takahiro
• Izumita Naoko
• Iijima Yuuki
• DEI Kanta

Classifications

• B23K35/0222

  for use in soldering or brazing (B23K35/0205 takes precedence) · CPC title

• B23K35/262 Primary

  Sn as the principal constituent · CPC title

• B22D21/027

  Casting heavy metals with low melting point, i.e. less than 1000 degrees C, e.g. Zn 419 degrees C, Pb 327 degrees C, Sn 232 degrees C · CPC title

• B23K35/0244

  Powders, particles or spheres; Preforms made therefrom · CPC title

• C22C13/02

  with antimony or bismuth as the next major constituent · CPC title