Soldering alloy and solder joint
US-2020384577-A1 · Dec 10, 2020 · US
Solder alloy, solder ball, and solder joint
US12447564B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12447564-B2 |
| Application number | US-202117912384-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 10, 2021 |
| Priority date | Mar 19, 2020 |
| Publication date | Oct 21, 2025 |
| Grant date | Oct 21, 2025 |
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- Title
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Abstract
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Provided are a solder alloy, a solder ball, and a solder joint which have an excellent pin contact performance and a high bonding strength. The solder alloy has an alloy composition consisting of, by mass %, Ag: 0.8 to 1.5%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.10%, and P: 0.006% to 0.009%, with the balance being Sn. The alloy composition preferably satisfies the following relations (1) and (2): 2.0≤Ag×Cu×Ni/P≤25, 0.500≤Sn×P≤0.778. Ag, Cu, Ni, P, and Sn in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.
First claim
Opening claim text (preview).
The invention claimed is: 1. A solder alloy having an alloy composition consisting of, by mass %: Ag: 0.8 to 1.5%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.10%, and P: 0.006% to 0.009%, with the balance being Sn. 2. A solder ball comprising the solder alloy according to claim 1 . 3. A solder joint comprising the solder alloy according to claim 1 . 4. The solder alloy according to claim 1 , wherein the alloy composition satisfies the following relation (3): 221≤(Ag+Cu+Ni)/P≤309 Relation (3) wherein Ag, Cu, Ni, and P in the relation (3) each represent the contents (mass %) thereof in the alloy composition. 5. A solder ball comprising the solder alloy according to claim 4 . 6. A solder joint comprising the solder alloy according to claim 4 . 7. The solder alloy according to claim 1 , wherein the alloy composition satisfies the following relations (1) and (2): 2.0≤Ag×Cu×Ni/P≤25 Relation (1) 0.500≤Sn×P≤0.778 Relation (2) wherein Ag, Cu, Ni, P, and Sn in the relations (1) and (2) each represent the contents (mass %) thereof in the alloy composition. 8. A solder ball comprising the solder alloy according to claim 7 . 9. A solder joint comprising the solder alloy according to claim 7 . 10. The solder alloy according to claim 7 , wherein the alloy composition satisfies the following relation (3): 221≤(Ag+Cu+Ni)/P≤309 Relation (3) wherein Ag, Cu, Ni, and P in the relation (3) each represent the contents (mass %) thereof in the alloy composition. 11. A solder ball comprising the solder alloy according to claim 10 . 12. A solder joint comprising the solder alloy according to claim 10 . 13. A solder alloy having an alloy composition consisting of, by mass %: Ag: 0.8 to 1.5%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.10%, and P: 0.0051% to 0.009%, with the balance being Sn, wherein the alloy composition satisfies the following relations (1) and (2): 2.0≤Ag×Cu×Ni/P≤25 Relation (1) 0.500≤Sn×P≤0.778 Relation (2) wherein Ag, Cu, Ni, P, and Sn in the relations (1) and (2) each represent the contents (mass %) thereof in the alloy composition. 14. A solder ball comprising the solder alloy according to claim 13 . 15. A solder joint comprising the solder alloy according to claim 13 . 16. The solder alloy according to claim 13 , wherein the alloy composition satisfies the following relation (3): 221≤(Ag+Cu+Ni)/P≤309 Relation (3) wherein Ag, Cu, Ni, and P in the relation (3) each represent the contents (mass %) thereof in the alloy composition. 17. A solder ball comprising the solder alloy according to claim 16 . 18. A solder joint comprising the solder alloy according to claim 16 .
Assignees
Inventors
Classifications
Alloys based on tin · CPC title
Powders, particles or spheres; Preforms made therefrom · CPC title
characterised by mechanical features, e.g. shape · CPC title
- B23K35/262Primary
Sn as the principal constituent · CPC title
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Frequently asked questions
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- What does patent US12447564B2 cover?
- Provided are a solder alloy, a solder ball, and a solder joint which have an excellent pin contact performance and a high bonding strength. The solder alloy has an alloy composition consisting of, by mass %, Ag: 0.8 to 1.5%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.10%, and P: 0.006% to 0.009%, with the balance being Sn. The alloy composition preferably satisfies the following relations (1) and (2): 2.0≤…
- Who is the assignee on this patent?
- Senju Metal Industry Co
- What technology area does this patent fall under?
- Primary CPC classification B23K35/262. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Oct 21 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).