Lead-free solder alloy, solder joint, solder paste composition, electronic circuit board, and electronic device
US-2018029169-A1 · Feb 1, 2018 · US
Solder paste
US11633815B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11633815-B2 |
| Application number | US-201917042551-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 22, 2019 |
| Priority date | Mar 30, 2018 |
| Publication date | Apr 25, 2023 |
| Grant date | Apr 25, 2023 |
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- Title
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Abstract
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Provided is a solder paste which uses a conventional flux, and for which long-term preservation is made possible and an easy preservation method can be realized by suppressing changes in the viscosity of the paste over time. This solder paste is provided with a solder powder, a zirconium oxide powder, and a flux, and changes in the viscosity of the paste over time are suppressed.
First claim
Opening claim text (preview).
The invention claimed is: 1. A solder paste in which change in viscosity over time is suppressed, the solder paste comprising: a mixture of a solder powder containing 42 mass % or more of Sn, a zirconium oxide powder, and a flux, the zirconium oxide powder being present in the mixture independent from the solder powder, wherein the solder paste contains 0.05 to 20.0% by mass of zirconium oxide powder with respect to the total mass of the solder paste; and the solder powder consists of: Sn; or Sn and at least one or more selected from a group consisting of Ag, Cu, Bi, Sb, Pb, Zn, Al, Co, Mn, Fe, Ge, Ga, P, Au, Pt, and Zr. 2. The solder paste according to claim 1 , wherein the solder powder contains Ag: more than 0% and 10.0% or less, in terms of mass %, with respect to the total mass of the solder powder. 3. The solder paste according to claim 1 , wherein the solder powder contains Cu: more than 0% and 10.0% or less, in terms of mass %, with respect to the total mass of the solder powder. 4. The solder paste according to claim 1 , wherein the solder powder contains Bi: more than 0% and 58% or less, in terms of mass %, with respect to the total mass of the solder powder. 5. The solder paste according to claim 1 , wherein the solder powder contains Sb: more than 0% and 20 0.0% or less, in terms of mass %, with respect to the total mass of the solder powder. 6. The solder paste according to claim 1 , wherein the solder powder contains one or more selected from the group consisting of Co, Mn, Fe, Ge, Ga, Au, and Pt: more than 0% and 10.0% or less, in terms of mass %, with respect to the total mass of the solder powder. 7. The solder paste according to claim 1 , wherein a particle size of the zirconium oxide powder is 0.5 μm or more and 5 μm or less.
Assignees
Inventors
Classifications
with aluminium as the next major constituent · CPC title
Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00 · CPC title
with antimony or bismuth as the next major constituent · CPC title
Alloys based on antimony or bismuth · CPC title
Zn as the principal constituent · CPC title
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Frequently asked questions
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- What does patent US11633815B2 cover?
- Provided is a solder paste which uses a conventional flux, and for which long-term preservation is made possible and an easy preservation method can be realized by suppressing changes in the viscosity of the paste over time. This solder paste is provided with a solder powder, a zirconium oxide powder, and a flux, and changes in the viscosity of the paste over time are suppressed.
- Who is the assignee on this patent?
- Senju Metal Industry Co
- What technology area does this patent fall under?
- Primary CPC classification B23K35/262. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Apr 25 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).