Solder alloy, solder powder, solder paste, and a solder joint using these
US-2021308808-A1 · Oct 7, 2021 · US
Solder alloy, solder paste, solder ball, solder preform, solder joint, in-vehicle electronic circuit, ECU electronic circuit, in-vehicle electronic circuit device and ECU electronic circuit device
US12569941B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12569941-B2 |
| Application number | US-202418746193-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 18, 2024 |
| Priority date | Jun 23, 2020 |
| Publication date | Mar 10, 2026 |
| Grant date | Mar 10, 2026 |
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- Title
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Abstract
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A solder alloy consisting of Ag: 3.1 to 4.0% by mass, Cu: 0.6 to 0.8% by mass, Bi: 1.5 to 5.5% by mass, Sb: 1.0 to 6.0% by mass, Co: 0.001 to 0.030% by mass, Fe: 0.02 to 0.05% by mass, As: 0.002 to 0.250% by mass, and a balance Sn.
First claim
Opening claim text (preview).
The invention claimed is: 1 . A solder alloy consisting of Ag: 3.1 to 4.0% by mass, Cu: 0.6 to 0.8% by mass, Bi: 1.5 to 5.5% by mass, Sb: 1.0 to 6.0% by mass, Co: 0.001 to 0.030% by mass, Fe: 0.02 to 0.05% by mass, As: 0.002 to 0.250% by mass, and a balance Sn, wherein the solder alloy exhibits at least the following characteristics: in a test substrate prepared by joining a Cu land to a chip resistor by reflow melting a solder paste comprising the solder alloy, an average value of the area ratios of the CuSn-based compounds spalled from a joined interface between the solder paste and the Cu land is less than 1%, and when the test substrate is subject to 3000 heat cycles of −55° C. to 150° C. and a holding time of 15 minutes, an average value of crack rates based on expected overall line crack length is less than 90%. 2 . The solder alloy according to claim 1 , wherein a sum of a value of the % by mass of Fe and a value of three times the % by mass of Co is 0.03 to 0.10. 3 . A solder paste having a solder powder being the solder alloy according to claim 1 , and a flux. 4 . A solder ball being the solder alloy according to claim 1 . 5 . A solder preform being the solder alloy according to claim 1 . 6 . A solder joint having the solder alloy according to claim 1 . 7 . An in-vehicle electronic circuit having the solder alloy according to claim 1 . 8 . An ECU electronic circuit having the solder alloy according to claim 1 . 9 . An in-vehicle electronic circuit device including the in-vehicle electronic circuit according to claim 7 . 10 . An ECU electronic circuit device including the ECU electronic circuit according to claim 8 .
Assignees
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Classifications
with antimony or bismuth as the next major constituent · CPC title
Pastes, creams or slurries · CPC title
Electric or electronic devices · CPC title
Soldering of electronic components · CPC title
Powders, particles or spheres; Preforms made therefrom · CPC title
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Frequently asked questions
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- What does patent US12569941B2 cover?
- A solder alloy consisting of Ag: 3.1 to 4.0% by mass, Cu: 0.6 to 0.8% by mass, Bi: 1.5 to 5.5% by mass, Sb: 1.0 to 6.0% by mass, Co: 0.001 to 0.030% by mass, Fe: 0.02 to 0.05% by mass, As: 0.002 to 0.250% by mass, and a balance Sn.
- Who is the assignee on this patent?
- Senju Metal Industry Co
- What technology area does this patent fall under?
- Primary CPC classification B23K35/262. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Mar 10 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).