Flux and solder paste
US-2024278360-A1 · Aug 22, 2024 · US
Pastes, creams or slurries
Pastes, creams or slurries · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K35/025 |
| Official title | {Pastes, creams or slurries} |
| Display label | Pastes, creams or slurries |
| Total patents | 905 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 79 |
| 2016 | 89 |
| 2017 | 122 |
| 2018 | 108 |
| 2019 | 86 |
| 2020 | 80 |
| 2021 | 78 |
| 2022 | 59 |
| 2023 | 67 |
| 2024 | 64 |
| 2025 | 60 |
| 2026 | 13 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Flux, substrate and manufacturing method, and device
US-2024282737-A1 · Aug 22, 2024 · US
Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit Device
US-2024238914-A1 · Jul 18, 2024 · US
Solder alloy, solder paste, and electronic circuit board
US-9221132-B2 · Dec 29, 2015 · US
Solder alloy, solder paste, and electronic circuit board
US-9221129-B2 · Dec 29, 2015 · US
Presintered preform for repair of superalloy component
US-2015367456-A1 · Dec 24, 2015 · US
Aluminum-tin paste and its use in manufacturing solderable electrical conductors
US-2015364615-A1 · Dec 17, 2015 · US
Solder Coated Clip And Integrated Circuit Packaging Method
US-2015348881-A1 · Dec 3, 2015 · US
Flux and solder paste
US-2015343571-A1 · Dec 3, 2015 · US
Lead-free solder alloy
US-2015328722-A1 · Nov 19, 2015 · US
Microwave brazing process and assemblies and materials therefor
US-9186742-B2 · Nov 17, 2015 · US
Lead-free solder paste
US-9185812-B2 · Nov 10, 2015 · US
Silver powder
US-2015314371-A1 · Nov 5, 2015 · US
Connection arrangement of an electric and/or electronic component
US-9177934-B2 · Nov 3, 2015 · US
Power module substrate, power module substrate with heat sink, power module, method of producing power module substrate, paste for copper sheet bonding, and method of producing bonded body
US-2015313011-A1 · Oct 29, 2015 · US
Method for connecting at least two components using a sintering process
US-2015306669-A1 · Oct 29, 2015 · US
Thermally decomposable polymer compositions for forming microelectronic assemblies
US-2015299509-A1 · Oct 22, 2015 · US
Brazing method
US-9162328-B2 · Oct 20, 2015 · US
Soldering method using a low-temperature solder paste
US-2015282332-A1 · Oct 1, 2015 · US
Solder alloy for die bonding
US-2015258637-A1 · Sep 17, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K35/025?
- CPC B23K35/025 is the Cooperative Patent Classification code for “Pastes, creams or slurries.”
- How many patents are filed under CPC B23K35/025 (Pastes, creams or slurries)?
- Our database includes 905 publications tagged with this CPC code.
- Is patent activity under CPC B23K35/025 growing?
- Publication counts under this code: 64 in 2024 vs 60 in 2025 (latest complete years).