Coherent fiber bundle parallel optical links
US-2026074796-A1 · Mar 12, 2026 · US
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Danesh Cameron patents
Danesh Cameron is listed as an inventor on 51 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Danesh Cameron |
| Total patents | 51 |
| First publication | Dec 3, 2020 |
| Latest publication | Mar 12, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
P-type doping in GaN LEDs for high speed operation at low current densities
US-12575224-B2 · Mar 10, 2026 · US
Multi-layer planar waveguide interconnects
US-2025383495-A1 · Dec 18, 2025 · US
Interconnect networks using microled-based optical links
US-2025310001-A1 · Oct 2, 2025 · US
Optically-enhanced multichip packaging
US-12395246-B2 · Aug 19, 2025 · US
Coherent fiber bundle parallel optical links
US-12395247-B2 · Aug 19, 2025 · US
P-type doping in gan leds for high speed operation at low current densities
US-2025234678-A1 · Jul 17, 2025 · US
MicroLED parallel optical interconnects
US-12332488-B2 · Jun 17, 2025 · US
Coherent fiber bundle parallel optical links
US-12334983-B2 · Jun 17, 2025 · US
Integration of oe devices with ics
US-2025093600-A1 · Mar 20, 2025 · US
Recent patents
Latest publications not already listed above.
Led chip-to-chip vertically launched optical communications with optical fiber
US-2025096907-A1 · Mar 20, 2025 · US
Interconnect networks using microLED-based optical links
US-12244355-B2 · Mar 4, 2025 · US
Multi-layer planar waveguide interconnects
US-12242102-B2 · Mar 4, 2025 · US
Light emitting diode device containing a positive photoresist insulating spacer and a conductive sidewall contact and method of making the same
US-12211828-B2 · Jan 28, 2025 · US
Integration of OE devices with ICS
US-12174441-B2 · Dec 24, 2024 · US
P-type doping in GaN LEDs for high speed operation at low current densities
US-12132146-B2 · Oct 29, 2024 · US
Hybrid integration of microLED interconnects with ICs
US-12101122-B2 · Sep 24, 2024 · US
LED chip-to-chip vertically launched optical communications with optical fiber
US-12101128-B2 · Sep 24, 2024 · US
Coherent fiber bundle parallel optical links
US-2024305379-A1 · Sep 12, 2024 · US
Interconnect networks using microled-based optical links
US-2024235697-A9 · Jul 11, 2024 · US
Enhanced microLEDs for inter-chip communications
US-12034096-B2 · Jul 9, 2024 · US
Interconnect networks using microled-based optical links
US-2024137132-A1 · Apr 25, 2024 · US
Light emitting diode device containing a positive photoresist insulating spacer and a conductive sidewall contact and method of making the same
US-2024113092-A1 · Apr 4, 2024 · US
Parallel optical communication channels using microLEDs
US-11916598-B2 · Feb 27, 2024 · US
Embedding LEDs with waveguides
US-11906779-B2 · Feb 20, 2024 · US
Integration of oe devices with ics
US-2024053558-A1 · Feb 15, 2024 · US
Multi-layer planar waveguide interconnects
US-2024036246-A1 · Feb 1, 2024 · US
P-type doping in gan leds for high speed operation at low current densities
US-2024030377-A1 · Jan 25, 2024 · US
Coherent fiber bundle parallel optical links
US-2024022330-A1 · Jan 18, 2024 · US
Coupling microleds to optical communication channels
US-2024012215-A1 · Jan 11, 2024 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Avicenatech Corp | 45 |
| Kalman Robert | 5 |
| Pezeshki Bardia | 5 |
| Danesh Cameron | 5 |
| Tselikov Alexander | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G02B6/43 | 24 |
| H10H20/855 | 21 |
| H04B10/25 | 20 |
| H04B10/40 | 20 |
| H10W90/00 | 19 |