Multi-layer planar waveguide interconnects

Patent metadata

Field	Value
Publication number	US-12242102-B2
Application number	US-202318485852-A
Country	US
Kind code	B2
Filing date	Oct 12, 2023
Priority date	Oct 1, 2020
Publication date	Mar 4, 2025
Grant date	Mar 4, 2025

Abstract

A multi-layer planar waveguide may be used in providing an interconnect for inter-chip and/or intra-chip signal transmission. Various embodiments to transmit optical signals are disclosed, along with designs of microLED optical assemblies, photodetector optical assemblies, waveguides, and multi-layer planar waveguides.

First claim

What is claimed is:

1. A multi-layer optical interconnect for integrated circuits, comprising:
a first transceiver array, the first transceiver array having a first plurality of microLEDs and a first plurality of photodetectors, the first plurality of microLEDs being mounted to a first substrate, the first plurality of photodetectors being in or mounted to the first substrate;
a second transceiver array, the second transceiver array having a second plurality of microLEDs and a second plurality of photodetectors, the second plurality of microLEDs being mounted to a second substrate, the second plurality of photodetectors being in or mounted to the second substrate; and
a multi-layer planar waveguide coupling light from the first plurality of microLEDs with the second plurality of photodetectors and coupling light from the second plurality of microLEDs with the first plurality of photodetectors, the multi-layer planar waveguide including a plurality of vertical waveguide layers optically coupled to a plurality of horizontal waveguide layers; and
wherein the plurality of horizontal waveguide layers are part of a modular assembly separate from the plurality of vertical waveguide layers of the multi-layer planar waveguide.

2. The multi-layer optical interconnect of claim 1 , further comprising at least one reflector for coupling light between the plurality of vertical waveguides and the plurality of horizontal waveguides of the multi-layer planar waveguide.

3. The multi-layer optical interconnect of claim 1 , wherein each vertical waveguide layer is optically coupled to a corresponding horizontal waveguide layer, and further comprising at least one reflector between each optically coupled vertical waveguide layer and horizontal waveguide layer.

4. The multi-layer optical interconnect of claim 1 , wherein each horizontal waveguide layer of the plurality of horizontal waveguide layers comprises a core, with cores of different ones of the plurality of horizontal waveguide layers separated by cladding layers.

5. The multi-layer optical interconnect of claim 4 , wherein each vertical waveguide layer of the plurality of vertical waveguide layers comprises a core, with cores of different ones of the plurality of vertical waveguides layers separated by further cladding layers.

6. The multi-layer optical interconnect of claim 1 , wherein the first substrate comprises a first integrated circuit chip and the second substrate comprises a second integrated circuit chip.

7. The multi-layer optical interconnect of claim 1 , wherein the first substrate and the second substrate are a same substrate, the same substrate comprising an integrated circuit chip.

Assignees

• Avicenatech Corp

Inventors

• Kalman Robert
• Pezeshki Bardia
• Tselikov Alexander
• Danesh Cameron

Classifications

• G02B6/0073

  Light emitting diode [LED] · CPC title

• G02B6/43 Primary

  Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections · CPC title

• G02B6/428

  containing printed circuit boards [PCB] · CPC title

• G02B6/4246

  Bidirectionally operating package structures · CPC title

• G02B6/4214

  the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device (G02B6/4246 takes precedence) · CPC title