Optically-enhanced multichip packaging

Patent metadata

Field	Value
Publication number	US-12395246-B2
Application number	US-202318215056-A
Country	US
Kind code	B2
Filing date	Jun 27, 2023
Priority date	Apr 13, 2020
Publication date	Aug 19, 2025
Grant date	Aug 19, 2025

Abstract

Optical chip-to-chip interconnects may use microLEDs as light sources. The interconnected chips may be on a same substrate. A pair of endpoint chips may each have associated optical transceiver subsystems, with transceiver circuitry in transceiver chips. Optical communications may be provided between the optical transceiver subsystems, with the optical transceiver subsystems in communication with their associated endpoint chips by way of metal layers in the substrate.

First claim

What is claimed is:

1. Optically interconnected integrated circuits, comprising:
a substrate having a first hole and a second hole, the first hole and the second hole each extending through the substrate;
a first integrated circuit (IC) chip, including logic circuitry, mounted to the substrate;
a first transceiver IC chip electrically connected to the first IC chip and mounted to the substrate and having a first active side facing the substrate with a portion of the first active side having a first plurality optoelectronic devices hanging over the first hole of the substrate;
the first plurality of optoelectronic devices having a first array of microLEDs and a first array of photodetectors;
the first plurality of optoelectronic devices coupled to the first transceiver IC chip by way of direct bonds;
a second IC chip, including logic circuitry, mounted to the substrate;
a second transceiver IC chip electrically connected to the second IC chip and mounted to the substrate, the second transceiver IC chip having a second active side facing the substrate with a portion of the second active side having a second plurality optoelectronic devices hanging over the second hole of the substrate;
the second plurality of optoelectronic devices having a second array of microLEDs and a second array of photodetectors;
the second plurality of optoelectronic devices coupled to the second transceiver IC chip by way of direct bonds;
a first optical coupling assembly on the first plurality of optoelectronic devices and a second optical coupling assembly on the second plurality of optoelectronic devices, the first optical coupling assembly at least in part in the first hole in the substrate and the second optical coupling assembly at least in part in the second hole in the substrate;
a waveguide having a plurality of waveguide cores inside the first hole and the second hole of the substrate and optically coupling the first and second plurality of optoelectronic devices.

2. The optically interconnected integrated circuits of claim 1 , wherein the substrate is made from a rigid material.

3. The optically interconnected integrated circuits of claim 1 , wherein the substrate is made from a flexible material.

4. The optically interconnected integrated circuits of claim 1 , wherein a first lens is placed between the first plurality of optoelectronic devices and the waveguide, and a second lens is placed between the second plurality of optoelectronic devices and the waveguide.

5. The optically interconnected integrated circuits of claim 4 , wherein the first lens is spaced apart from the first plurality of optoelectronic devices by one focal length and the second lens is spaced apart from the second plurality of optoelectronic devices by one focal length.

6. The optically interconnected integrated circuits of claim 1 , further comprising a first turning mirror between the first plurality of optoelectronic devices and the waveguide and a second turning mirror between the second plurality of optoelectronic devices and the waveguide.

7. The optically interconnected integrated circuits of claim 1 , wherein the substrate includes metal signal layers connecting the first IC chip and the second IC chip.

8. The optically interconnected integrated circuits of claim 1 , wherein the first array of microLEDs and the first array of photodetectors are arranged in a first set of tiles and the second array of microLEDs and the second array of photodetectors are arranged in a second set of tiles.

Assignees

• Avicenatech Corp

Inventors

• Kalman Robert
• Pezeshki Bardia
• Tselikov Alexander
• Danesh Cameron

Classifications

• H04B10/502

  LED transmitters · CPC title

• G02B6/4246

  Bidirectionally operating package structures · CPC title

• G02B6/43

  Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections · CPC title

• H04B10/40 Primary

  Transceivers · CPC title

• H04B10/801 Primary

  using optical interconnects, e.g. light coupled isolators, circuit board interconnections · CPC title