Semiconductor device including vertical memory structure and separation structure each including side surface slope changing portion and data storage system including the same
US-12490428-B2 · Dec 2, 2025 · US
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Chung Giyong patents
Chung Giyong is listed as an inventor on 21 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chung Giyong |
| Total patents | 21 |
| First publication | Nov 5, 2020 |
| Latest publication | Dec 2, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Vertical non-volatile memory devices having a multi-stack structure with enhanced photolithographic alignment characteristics
US-12376286-B2 · Jul 29, 2025 · US
Three-dimensional semiconductor memory device and electronic system including the same
US-12363904-B2 · Jul 15, 2025 · US
Semiconductor device and data storage system including the same
US-2025056808-A1 · Feb 13, 2025 · US
Semiconductor device having dummy structures in a peripheral region and data storage system including the same
US-12185548-B2 · Dec 31, 2024 · US
Vertical non-volatile memory devices having a multi-stack structure with enhanced photolithographic alignment characteristics
US-2024138141-A1 · Apr 25, 2024 · US
Memory device and electronic system including the same
US-11956965-B2 · Apr 9, 2024 · US
Vertical non-volatile memory devices having a multi-stack structure with enhanced photolithographic alignment characteristics
US-11895827-B2 · Feb 6, 2024 · US
Semiconductor device, method of manufacturing the same, and massive data storage system including the same
US-11856770-B2 · Dec 26, 2023 · US
Semiconductor device and method of manufacturing the same
US-11844214-B2 · Dec 12, 2023 · US
Recent patents
Latest publications not already listed above.
Three-dimensional semiconductor memory devices having a source structure that overlaps a buried insulating layer
US-11616078-B2 · Mar 28, 2023 · US
Three-dimensional semiconductor memory device and electronic system including the same
US-2022328511-A1 · Oct 13, 2022 · US
Semiconductor device and data storage system including the same
US-2022310639-A1 · Sep 29, 2022 · US
Vertical non-volatile memory devices having a multi-stack structure with enhanced photolithographic alignment characteristics
US-2022199626-A1 · Jun 23, 2022 · US
Semiconductor device and method of manufacturing the same
US-2022149060-A1 · May 12, 2022 · US
Semiconductor device, method of manufacturing the same, and massive data storage system including the same
US-2022139945-A1 · May 5, 2022 · US
Semiconductor device and data storage system including the same
US-2022102369-A1 · Mar 31, 2022 · US
Memory device and electronic system including the same
US-2022085037-A1 · Mar 17, 2022 · US
Three-dimensional semiconductor memory devices
US-2021384220-A1 · Dec 9, 2021 · US
Three-dimensional semiconductor memory devices having source structure overlaps buried insulating layer
US-11114461-B2 · Sep 7, 2021 · US
Three-dimensional semiconductor memory devices
US-2020350330-A1 · Nov 5, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 21 |
Top CPC classifications
Most common classification codes across this inventor's patents.